Minimum qualification is a Diploma in Electronics/Microelectronics.
The candidate should have Failure Analysis experience in Package or Die level FA or Reliability analysis experience for a minimum of 1 year and above in semiconductor manufacturing related company.
Well versed in using FA & Rel related equipment such as Microscope, Parametric Analyzer, X-ray, CSAM, SEM-EDX, Decapper, TDR, Micro Prober station, FTIR, HAST, Bake oven, Reflow machine, TC chamber, Burn in oven and etc.
...
Site Management
Construction Safety
Quality Control
Team Leadership
Blueprint Reading
Problem Solving
Resource Allocation
Communication Skills
Schedule Management
Risk Assessment