Test Hardware Integration: Collaborate with PCB and probe card designers to optimize test hardware for power and signal integrity at high speed (PCIe Gen6, HBM4, Maxphy, 400G+ SerDes). Actively debug hardware-software interface issues on the loadboard and probe card levels.
Test Hardware Integration: Collaborate with PCB and probe card designers to optimize test hardware for power and signal integrity at high speed (PCIe Gen6, HBM4, Maxphy, 400G+ SerDes). Actively debug hardware-software interface issues on the loadboard and probe card levels.
Test Hardware Integration: Collaborate with PCB and probe card designers to optimize test hardware for power and signal integrity at high speed (PCIe Gen6, HBM4, Maxphy, 400G+ SerDes). Actively debug hardware-software interface issues on the loadboard and probe card levels.
Test Hardware Integration: Collaborate with PCB and probe card designers to optimize test hardware for power and signal integrity at high speed (PCIe Gen6, HBM4, Maxphy, 400G+ SerDes). Actively debug hardware-software interface issues on the loadboard and probe card levels.
Evaluate new packaging material and ensure the packaging fitness for use and handling of all packing material documentation which is part of quality system.
- Perform dimensional/functional inspection of First Article (FA), Incoming, In-process or Outgoing parts in accordance to Work Instructions to ensure that components and products conform to specifications
Review, investigate and report quality, compliance and operational exceptions, including audit findings, system-generated exceptions and potential control breaches, and support timely remediation and issue resolution.
Familiar with data centre construction quality requirements, testing and commissioning procedures, and relevant standards including ISO 9001, ANSI/TIA-942, ASHRAE thermal guidelines, Uptime Institute Tier principles, ASTM, ANSI, ACI, Singapore Standards and applicable Codes of Practice will be advantageous.