Minimum qualification is a Diploma in Electronics/Microelectronics.
The candidate should have Failure Analysis experience in Package or Die level FA or Reliability analysis experience for a minimum of 1 year and above in semiconductor manufacturing related company.
Well versed in using FA & Rel related equipment such as Microscope, Parametric Analyzer, X-ray, CSAM, SEM-EDX, Decapper, TDR, Micro Prober station, FTIR, HAST, Bake oven, Reflow machine, TC chamber, Burn in oven and etc.
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Customer Service
Inventory Management
Point of Sale (POS) Systems
Teamwork
Cash Handling
Communications Skills
Basic Math Skills
Transaction Processing
Good electro-mechanical equipment troubleshooting skills.
Read and orally communicate in Mandarin (writing ability not required).
Willing to travel
work under pressure and take on technical challenge.
Oversea work experience is a plus.
Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.