51份Die Attach 工作机会 - 最新工作招聘 - October 2026
显示51个工作的结果
"die attach"
Undisclosed
- Education Requirement:
- Degree in Electronics / Electrical /Chemical/Mechanical Engineering
- Additional Desirable Qualifications: ...
最后机会申请此工作。
Posted
2 months ago
Undisclosed
- Degree in Mechanical/ Electronics / Electrical /Mechanical Engineering.
- Min 2 years in semiconductor industry in the field of assembly engineering.
- Experience in die/glass attach process. ...
最后机会申请此工作。
Posted
a month ago
Undisclosed
- Degree in Mechanical & Electrical Engineering / Mechatronic Engineering / Electrical & Electronics Engineering.
- At least 1-2 years of experience in relevant fields.
- Familiar with equipment operation and know basic maintenance of production equipment/machine. ...
Posted
a month ago
Undisclosed
- Education Requirement:
- Additional Desirable Qualifications:
- Education Requirement: ...
Posted
a month ago
Undisclosed
- Education Requirement:
- Additional Desirable Qualifications:
- Education Requirement: ...
Posted
a month ago
Undisclosed
- Education Requirement:
- Additional Desirable Qualifications:
- Education Requirement: ...
Posted
a month ago
Undisclosed
- Degree in Mechanical & Electrical Engineering / Mechatronic Engineering / Electrical & Electronics Engineering.
- At least 1-2 years of experience in relevant fields.
- Familiar with equipment operation and know basic maintenance of production equipment/machine. ...
Posted
a month ago
Undisclosed
- Degree in Mechanical & Electrical Engineering / Mechatronic Engineering / Electrical & Electronics Engineering.
- At least 1-2 years of experience in relevant fields.
- Familiar with equipment operation and know basic maintenance of production equipment/machine. ...
Posted
a month ago
Undisclosed
- Degree in Mechanical & Electrical Engineering / Mechatronic Engineering / Electrical & Electronics Engineering.
- At least 1-2 years of experience in relevant fields.
- Familiar with equipment operation and know basic maintenance of production equipment/machine. ...
Posted
a month ago
Undisclosed
- Degree in Mechanical & Electrical Engineering / Mechatronic Engineering / Electrical & Electronics Engineering.
- At least 1-2 years of experience in relevant fields.
- Familiar with equipment operation and know basic maintenance of production equipment/machine. ...
Posted
a month ago
Undisclosed
- Education Requirement:
- Additional Desirable Qualifications:
- Education Requirement: ...
Posted
a month ago
Undisclosed
- Education Requirement:
- Additional Desirable Qualifications:
- Education Requirement: ...
Posted
a month ago
SGD2,500 - SGD5,000 每月
Singapore, Singapore
- Diploma or Degree in Mechanical Engineering or related Technical disciplines.
- Minimum 3 years of design experiences in semiconductor machines or automations.
- Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus. ...
Posted
2 months ago
SGD2,500 - SGD5,000 每月
Singapore, Singapore
- Diploma or Degree in Mechanical Engineering or related Technical disciplines.
- Minimum 3 years of design experiences in semiconductor machines or automations.
- Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus. ...
Posted
2 months ago
SGD2,500 - SGD5,000 每月
Singapore, Singapore
- Diploma or Degree in Mechanical Engineering or related Technical disciplines.
- Minimum 3 years of design experiences in semiconductor machines or automations.
- Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus. ...
Posted
2 months ago
SGD2,500 - SGD5,000 每月
Singapore, Singapore
- Diploma or Degree in Mechanical Engineering or related Technical disciplines.
- Minimum 3 years of design experiences in semiconductor machines or automations.
- Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus. ...
Posted
2 months ago
SGD2,500 - SGD5,000 每月
Singapore, Singapore
- Diploma or Degree in Mechanical Engineering or related Technical disciplines.
- Minimum 3 years of design experiences in semiconductor machines or automations.
- Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus. ...
Posted
2 months ago
SGD2,500 - SGD5,000 每月
Singapore, Singapore
- Diploma or Degree in Mechanical Engineering or related Technical disciplines.
- Minimum 3 years of design experiences in semiconductor machines or automations.
- Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus. ...
Posted
2 months ago