Major in computer science or related (Degree or above) with at least 3 years working experience
Familiar with Oracle/SQL Server and other database technologies, and proficient in using common SQL language.
Good communication and teamwork skills, strong stress resistance and execution, able to adapt to business trips Proficient in using various common tools for IT projects, such as WORD, PPT and other common tools
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Bachelor’s degree or higher in Material Science, Physics, Mechanical, or Chemical Engineering, or equivalent.
Knowledge of analytical tools such as Parametric Analyzer, Keithley Meter, TDR, EOTPR, SEM/EDX, FIB, FTIR, X-Ray, Acoustic Imaging, and IR Imaging tools.
Strong analytical thinking and problem-solving skills.
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Good electro-mechanical equipment troubleshooting skills.
Read and orally communicate in Mandarin (writing ability not required).
Willing to travel
work under pressure and take on technical challenge.
Oversea work experience is a plus.
Minimum qualification is a Diploma in Electronics/Microelectronics.
The candidate should have Failure Analysis experience in Package or Die level FA or Reliability analysis experience for a minimum of 1 year and above in semiconductor manufacturing related company.
Well versed in using FA & Rel related equipment such as Microscope, Parametric Analyzer, X-ray, CSAM, SEM-EDX, Decapper, TDR, Micro Prober station, FTIR, HAST, Bake oven, Reflow machine, TC chamber, Burn in oven and etc.
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Diploma/Degree in Engineering, Science, Chemistry, or Business
1–3 years of sales experience preferred (industrial products / chemicals / semiconductor industries); fresh graduates are encouraged to apply
Fluent in English, Mandarin, and Bahasa Malaysia (oral & written). We are seeking candidates proficient in Mandarin to effectively communicate with Mandarin-speaking clients.
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Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.