- Follow up all on going evaluation in the assigned area and handle on the line technical trouble.
30+ days
32 Wire Bond Technician Jobs - October 2026 - High Salaries
Showing 32 jobs results for
"wire bond technician"
- Follow up all on going evaluation in the assigned area and handle on the line technical trouble.
30+ days
Wire Bond Technician - Operator
8 days
Wire Bond Technician - Operator
- Complete production records, conduct routine equipment checks, and maintain 5S standards.
9 days
Wire Bond Engineer
- Bachelor’s degree in Electrical/Electronic Engineering, Materials Science, or a related technical field.
26 days
Maintenance Wire Bond Engineer
- Diploma or degree in Electrical, Electronic, Mechanical, or Mechatronic Engineering, or a related field.
26 days
MAINTENANCE TECHNICIAN (DIE BOND-WIRE BOND-ENCAPSULATION-TEST PROCESS)
- Mount and secure different types of electrical motors, sensors and switches onto assemblies and sub-assemblies.
17 days
19 days
Senior Staff Engineer Unit Process Development Wire Bond
- Generate, maintain, and ensure the accuracy of development-related documentation, including Process Specifications, PFMEA, DFMEA, OJTI, T32, PDR, Process of Record, Assembly Design Rules, Process Roadmaps, Failure Catalogues, Control Plans, and Maintenance Checklists.
13 days
Staff Engineer Unit Process Development Wire Bond
- Own and maintain process documentation, including Process Specifications, PFMEA, DFMEA, OJTI, T32, and Process Development Reports (PDR).
23 days
Engineer II (Phicom-Wirebond)
21 days
Process Development Engineer (Wire Bond)
- Support new tape and material development, supplier qualification and technology benchmarking.
3 days
Wire Bond-Manufacturing Engineer
- Support NPI by developing new wire bond process flows, including DOE-driven process windows
4 days
Wire Bond Process Engineer
- Process control knowledge-Control Plan, FMEA, SPC, MSA, 8D, DOE, Minitab, PBI.
5 days
- Process Engineering – Overall / Integration
5 days
Wire Bond - Die Attach Equipment Engineer (MES Project)
- Sustaining (Post-Project Phase): Transition to a production role to manage equipment reliability, troubleshoot MES-related equipment issues, and leverage your implementation knowledge to drive continuous improvement in automation and uptime.
6 days
Senior Wirebond Process Engineer
- Define applicable wirebond materials for specific applications (wire type, capillary part numbers, etc)
10 days
Senior Wirebond Process Engineer
- Define applicable wirebond materials for specific applications (wire type, capillary part numbers, etc)
10 days
- Coach and develop new engineers in their daily activities and improvement projects.
10 days
- Lead or support equipment selection and new equipment introduction: define statement of purpose/requirements, work with suppliers and stakeholders to develop process algorithms, machine hardware, and software from buy-off through release to manufacturing.
15 days
Wire Bond Process Engineer
21 days
Process Development Senior Engineer (Wire Bond)
- Knowledge in process development step and statistic.
22 days
- Experience with equipment qualification, validation, acceptance, and machine capability studies.
21 days
- Monitor and analyze equipment performance indicators, including OEE, MTBF, MTTR, utilization, and downtime trends.
23 days
Wire Bond-Manufacturing Engineer
- Support NPI by developing new wire bond process flows, including DOE-driven process windows
25 days
Associate Engineer – Wire Bond Equipment
21 days
- Process Engineering – Overall / Integration
27 days
Wire Bond - Die Attach Equipment Engineer (MES Project)
- Sustaining (Post-Project Phase): Transition to a production role to manage equipment reliability, troubleshoot MES-related equipment issues, and leverage your implementation knowledge to drive continuous improvement in automation and uptime.
28 days
Associate Engineer – Wire Bond Equipment
- Monitor equipment performance and implement improvement actions.
25 days
- Lead or support equipment selection and new equipment introduction: define statement of purpose/requirements, work with suppliers and stakeholders to develop process algorithms, machine hardware, and software from buy-off through release to manufacturing.
30+ days