200+ Packaging Engineer Jobs in Malaysia | Job Vacancies | June 2026

Accountable for delivering reliable, manufacturable, and cost-effective package solutions, while influencing key technology decisions and enabling competitive advantage.
Acting as a technical leader, the role ensures strong cross-functional collaboration, drives continuous improvement, and identifies future-ready assembly technologies to sustain long-term growth.
Ensure good communication and stakeholder management. ...

Posted

12 hours ago

Senior Engineer Unit Process Development Die Attach Senior Engineer Unit Process Development Die Attach

Infineon Technologies

Undisclosed

Full Time

Malacca City

Support prototype and development samples build.
Provide inputs for updating of related documents and is responsible for their correct contents, e.g, Process Specification, Assembly Design Rule, Process Roadmap, Failure Catalogue, Control Plan, FMEA, OJTI/WI, T32 etc for development projects.
Collaborate with suppliers to promote continuous improvement and carry out verification and qualification activities for new tooling, machinery, and materials in development projects. ...

Posted

4 days ago

PRODUCTION OPERATOR-PACKER (3-6 MONTHS CONTRACT) PRODUCTION OPERATOR-PACKER (3-6 MONTHS CONTRACT)

ALWAYSHIRED PTE. LTD.

SGD11 - SGD11 Per Month

Full Time

Singapore

Posted

3 months ago

Senior Flip Chip Manufacturing Process Engineer Senior Flip Chip Manufacturing Process Engineer

Texas Instruments

Undisclosed

Full Time

Malacca City

Support die attach processes for customer deliverable materials. (i.e. specialization for flip chip packages)
Document die attach process details in specification(s) and work instructions
Define applicable die attach materials for specific applications (flux, solder paste, bumps, etc.) ...

Posted

3 days ago

TS - Senior Package Equipment Engineer- Package Equipment Engineer TS - Senior Package Equipment Engineer- Package Equipment Engineer

Technip Energies

Undisclosed

Full Time

KL City

Good Professional Check (feedback) from past Employers / Clients.

Posted

24 days ago

Research Fellow [Optical Interconnects - Photonic Packaging (Process and Testing)] Research Fellow [Optical Interconnects - Photonic Packaging (Process and Testing)]

NATIONAL UNIVERSITY OF SINGAPORE

SGD6,000 - SGD6,000 Per Month

Full Time

Singapore

The Department of Electrical and Computer Engineering (ECE) at the National University of Singapore (NUS) is seeking a Research Fellow to support the development of a detachable fiber array unit (FAU) for co-packaged optics (CPO) systems. The role will focus on process and/or testing. Candidates will contribute to the design, fabrication, assembly, testing, and validation of flexible optical coupling structures and standardized optical interfaces for FAU integration in CPO systems. The work will be closely linked with simulation-driven design and optimization using tools such as ANSYS Multiphysics and/or COMSOL Multiphysics. This is an exciting opportunity to work at the forefront of semiconductor photonics and advanced optical packaging in close collaboration with industry partners and academic researchers
Responsibilities will involve:
Fabrication & Process Developmenta) Design the fabrication methods, process flow, and specifications. b) Fabrication of the FAU with high V-groove pitch accuracy and uniform array flatness.c) Fabricate optical coupling configurations, including vertical and/or edge coupling. d) Fabricate mechanically constrained FAU interfaces using precision-defined contactor-target geometries.e) Optimize low-expansion adhesive systems that preserve optical attachment. ...

Posted

20 days ago

PRODUCTION OPERATOR-PACKER (3-6 MONTHS CONTRACT) PRODUCTION OPERATOR-PACKER (3-6 MONTHS CONTRACT)

ALWAYSHIRED PTE. LTD.

SGD11 - SGD11 Per Month

Full Time

Singapore

Posted

3 months ago

Senior Staff Engineer Unit Process Development Die Bond Senior Staff Engineer Unit Process Development Die Bond

Infineon Technologies

Undisclosed

Full Time

Malacca City

Provide inputs for updating of related documents and responsible for their correct contents, e.g. Process of Record, Assembly Design Rule, Process Roadmap, Failure Catalogue, Control Plan, Maintenance checklist,etc. for development projects.
Liaise with suppliers for continuous improvement and perform verification and qualification activities for new tooling, machines and materials in development projects.
Participate and support problem solving team using statistical and analytical tools, e.g. SPC, APC, DOE, 8D, FMEA, DFMEA. ...

Posted

18 days ago

Senior Flip Chip Manufacturing Process Engineer Senior Flip Chip Manufacturing Process Engineer

Texas Instruments

Undisclosed

Full Time

Malacca City

Support die attach processes for customer deliverable materials. (i.e. specialization for flip chip packages)
Document die attach process details in specification(s) and work instructions
Define applicable die attach materials for specific applications (flux, solder paste, bumps, etc.) ...

Posted

25 days ago