19 days
200+ Packaging Engineer Jobs in Malaysia | Job Vacancies | November 2026 | Ricebowl - Page 8
Showing 277 jobs results for
"packaging engineer"
Package Manager [SGP]
- Support RFQ preparation, participate in bid clarifications (technical and commercial), and agree on recommendations for purchase.
30+ days
Wire Bond-Manufacturing Engineer
- Support NPI by developing new wire bond process flows, including DOE-driven process windows
30+ days
- Own project planning, scheduling, risk management, and cross‑functional coordination to drive alignment and timely issue resolution.
30+ days
- Forklift Checklist: Complete a checklist before using the forklift.
30+ days
Packaging Plant Operator
- Monitor equipment, operate control, process samples, adjust machine processes using selectivity and judgement and utilize computer systems to input and record data.
30+ days
Chocolate Packer ($12-hour- Boon Lay-10am-7pm- 5 working day)
30+ days
Service Technician (Beer)
- Maintain a structured inventory of dispensers, gas tanks, regulators, hoses, and accessories.
30+ days
Chocolate Packer ($12-hour- Boon Lay-10am-7pm- 5 working day)
30+ days
- Own project planning, scheduling, risk management, and cross‑functional coordination to drive alignment and timely issue resolution.
30+ days
Chocolate Packer ($12-hour- Boon Lay-10am-7pm- 5 working day)
30+ days
Chocolate Packer ($12-hour- Boon Lay-10am-7pm- 5 working day)
30+ days
Manager - Senior Manager, Mechanical Manufacturing - Advanced Packaging Equipment Engineering
- Manage equipment maintenance, lifecycle planning, spare parts, and reliability improvement.
11 days
30+ days
30+ days
- Good Professional Check (feedback) from past Employers / Clients.
7 days
- Coach and develop new engineers in their daily activities and improvement projects.
9 days
Staff-Principal Engineer, Advanced Package Metrology-Real-Time Defect Analysis
- Establish inspection methodologies and best-known methods (BKM) for metrology processes
11 days
Process Engineer (Ti-Etch, Solder ball attach, package saw)
- Lead process characterization, optimization, and qualification activities for Plasma Etching, Solder Ball Attach, and Package Saw.
12 days
Process Engineer (Ti-Etch, Solder ball attach, package saw)
- Lead process characterization, optimization, and qualification activities for Plasma Etching, Solder Ball Attach, and Package Saw.
12 days
Technician (Electrical - Electronic) - Packaging Industry
- Printing machines (Flexo / Rotogravure)
12 days
Maintenance Technician (Shift) Package Saw
- The goal of this position is to perform preventive maintenance in the Saw Singulation area to achieve the company’s objectives, particularly regarding machine performance.
12 days
Assistant Manager, Packaging Quality Stream Lead
- Establish and maintain optimal process parameters to maximize production efficiency while ensuring compliance with quality standards and specifications.
13 days
11 days
Die-Layer Attach Process Development Staff Engineer
- Hands-on and process development experience in FOL related processes e.g. sawing, die attach and wire bond process.
12 days
Process Package Manager (Industrial - Science) - KL-Selangor
- Review technical submissions, designs, and specifications.
23 days
20 days
Research Fellow [Silicon Photonics and Packaging]
- The Department of Electrical and Computer Engineering (ECE) at the National University of Singapore (NUS) is seeking a Research Fellow to lead on the area of Silicon photonics and packaging. You will work closely with our researchers, students, and professors, including industry collaborators to understand and derive insights from scientific experiments and data. This is an exciting opportunity to work at the forefront of semiconductor photonics and advanced optical packaging in close collaboration with industry partners and academic researchers
12 days
Research Fellow [Silicon Photonics and Packaging]
- d) Develop and optimize fabrication processes for novel optical coupling structures, incorporating Design for Manufacturability (DfM) and Design for Testability (DfT) principles to ensure scalability, process robustness, and reliability.
13 days
23 days