200+ Packaging Engineer Jobs in Malaysia | Job Vacancies | June 2026 | Ricebowl
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"packaging engineer"
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Job "packaging engineer"
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MYR4,000 - MYR6,000 Per Month
- Process Improvement: Analyze existing packaging and handling methods to propose modifications that enhance floor efficiency, reduce costs, and minimize material waste.
- Testing & Validation: Support basic packaging testing activities to evaluate durability, drop performance, and handling stability.
- Compliance & Standards: Ensure all packaging designs comply with internal production logistics, safety guidelines, and labeling standards. ...
Posted
10 days ago
SGD3,000 - SGD3,000 Per Month
Singapore
- Act as a subject matter expert and resource for colleagues in integration teams.
- Work with Fab team in establishing statistical process control for thin film module.
- Generate and present reports to both internal and external customers. ...
Posted
22 days ago
Research Fellow, Computational Biologist (Life Sciences Institute, Neurobiology) Research Fellow, Computational Biologist (Life Sciences Institute, Neurobiology)
Research Engineer (Optical Interconnects & Photonic Packaging (Simulation/Modeling))
Undisclosed
Singapore
- Lead the establishment and optimisation of complex experimental protocols, overseeing laboratory workflows and providing mentorship and supervision to junior researchers and students.
- Maintain meticulous documentation of experimental data, perform robust analyses, and contribute substantively to the preparation of manuscripts for submission to leading scientific journals.
- Present research outcomes at national and international symposia, fostering knowledge exchange and networking within the global neuroscience community. ...
Posted
17 days ago
MYR4,500 - MYR5,500 Per Month
Port Klang
- Prepare structural drawings, mockups, and prototypes for customer evaluation.
- Work with production teams to ensure packaging designs are practical for manufacturing.
- Evaluate new materials or packaging concepts to improve performance or reduce cost. ...
Posted
19 days ago
Research Fellow [Optical Interconnects - Photonic Packaging (Process and Testing)] Research Fellow [Optical Interconnects - Photonic Packaging (Process and Testing)]
Research Engineer (Optical Interconnects & Photonic Packaging (Simulation/Modeling))
Undisclosed
Singapore
- Excellent communication skills and the ability to work effectively in a collaborative research environment.
- Strong analytical, problem-solving, technical writing, and presentation skills.
- Self-motivated, able to work independently, and collaborate within a diverse team. ...
Posted
18 days ago
Undisclosed
Prai
- Prepare quotations, proposals, and commercial presentations while following up closely on sales opportunities.
- Build and maintain strong relationships with existing customers to ensure long-term business retention and growth.
- Serve as a key contact for customers, ensuring prompt response to inquiries, issue resolution, and service excellence. ...
Posted
a day ago
Research Engineer - Senior Research Engineer (PVD for Advanced Packaging) (APM-Thin Film), IME Research Engineer - Senior Research Engineer (PVD for Advanced Packaging) (APM-Thin Film), IME
A*STAR - Agency For Science, Technology And Research
Undisclosed
Singapore
- Act as a subject matter expert and resource for colleagues in integration teams.
- Work with Fab team in establishing statistical process control for thin film module.
- Generate and present reports to both internal and external customers. ...
Posted
25 days ago
Research Assistant (N.1 Institute of Health, A-P Christopher Asplund's Lab) Research Assistant (N.1 Institute of Health, A-P Christopher Asplund's Lab)
Research Engineer (Optical Interconnects & Photonic Packaging (Process And Testing))
Undisclosed
Singapore
- Help to prepare and manage experimental documents (IRB applications, consent forms, reimbursement sheets, etc) and reports for funders and the scientific community.
- Assist in data management and processing (e.g., coding or scoring of surveys).
- Perform literature review and communicate learnings to the lab. ...
Posted
17 days ago
Research Engineer (Optical Interconnects & Photonic Packaging (Process And Testing))
Undisclosed
Singapore
- experimental validation of test structures with dataflow adaptation in single chip, high memory-logic interspersion
- experimental validation of chiplet interfaces and synchronization, test structures with final memory-logic aggregation, and dataflow adaptation across chiplets
- experimental validation of final testchip in single- and many-chiplet arrangement ...
Posted
17 days ago
Undisclosed
- Pro-active collaboration in the global CoC and the related sub-CoC group (Center of Competence). Develop suitable strategies to execute governance over the core process within the area of regional responsibility defined for the BTC-AP BMI.
- Collaborate with R&D to promote the simultaneous engineering process for combined product and process development with the aim of generating manufacturable new products in accordance with the CoE’s and division’s needs.
- Conduct early evaluations of manufacturing technology suppliers in APAC region which would enhance B. Braun manufacturing capabilities, especially in the area of innovative automation technologies around the packaging processes. Provide training concepts and execution recommendations for technically skilled workers, to be implemented by a technical training center. ...
Posted
a day ago
Undisclosed
Singapore
- Collaborate and develop effective working relationships with technology partners to accomplish project/ task goals within committed schedule.
- Develop new and impactful ideas, materials, solutions, and/ or procedures for product fabrication process and technology meeting the business goals and launch schedule with competitive manufacturing costs.
- Serve as technology subject matter expert applying technical knowledge and skills in own area of expertise to address moderately complex issues in manufacturing environment. ...
Posted
5 days ago
Undisclosed
George Town
- Cultivate and expand global accounts in close alignment with international sales divisions.
- Deliver consultative sales proposals featuring tailored packaging solutions and sustainable, eco-friendly materials.
- Lead the entire project lifecycle seamlessly from initial consultation and quotation through to negotiation and final execution. ...
Posted
14 days ago
SGD3,800 - SGD3,800 Per Month
Singapore
- Working with process and product development engineers to create process flow and initial equipment list required in projects
- Collaborate with cross-functional teams to resolve product or process-related issues
- Developing and maintaining documentations like FMEA, machine and process buy-off document ...
Posted
20 hours ago
Junior Production Engineer (Food Packaging Manufacturer) Junior Production Engineer (Food Packaging Manufacturer)
AP Carriera Talent Resources Sdn Bhd
MYR2,500 - MYR4,000 Per Month
Malaysia
- · To assist the plant manager with the planning, coordination and control of all manufacturing processes and schedule stability to ensure that products are produced efficiently, with appropriate resources, at the right quality, whilst consistently providing the best return on the assets;
- · To apply fundamental manufacturing principles and assist with strategies which minimize manufacturing costs through effective utilization of manpower, equipment, facilities, materials, and capital;
- · To be responsible for providing engineering support to the production department and ensuring that the preventive maintenance plan for the assets and facilities are adhered to at all times; ...
Posted
19 days ago
Undisclosed
Malaysia
- Responsible for the work specification definition of production line OP and update the SOP
- Responsible for yield and SPC improvement
- Responsible for the optimization and maintenance of FMEA/OCPA/SPEC ...
Posted
18 days ago
SGD4,750 - SGD4,750 Per Month
Singapore
- The Department of Electrical and Computer Engineering (ECE) at the National University of Singapore (NUS) is seeking a Research Engineer to support the development of a detachable fiber array unit (FAU) for co-packaged optics (CPO) systems. The role will focus on simulation and modeling. Candidates will contribute to the design, development, and validation of flexible optical coupling structures and standardized optical interfaces for FAU integration in CPO systems, using tools such as ANSYS Multiphysics and/or COMSOL Multiphysics. This is an exciting opportunity to work at the forefront of semiconductor photonics and advanced optical packaging in close collaboration with industry partners and academic researchers.
- Responsibilities will include:
- Design• Design FAU array geometry.• Develop optical coupling schemes as a unified optical-interface strategy, including vertical coupling and edge coupling.• Design FAU mechanical alignment structures that provide kinematic constraint in x- and y-axes and angular orientation.• Select and optimize low-expansion adhesives that maintain optical alignment stability and allow corrective reattachment.2. Modeling & Simulation• Determine the required FAU capacity model, including wavelength tolerances, array flatness, thermo-optical, and thermo-mechanical interactions affecting optical alignment.• Simulate combined optical coupling behavior by evaluating coupling-element interfaces for vertical coupling and edge coupling. • Use mechanical modeling to simulate FAU alignment behavior, in particular kinematic coupling of contactor-target pair during attachment cycles.• Extend thermo-mechanical-optical simulations to study temperature-driven stress, material expansion mismatch, and drift or relaxation mechanisms.3. Project Management & Collaboration• Contribute research in alignment with project objectives and timelines.• Support technical reports, publications, and presentations for both academic and industry audiences.4. Innovation & Intellectual Property• Assist in patent filings, technology disclosures, and commercialization efforts. ...
Posted
17 days ago
SGD4,750 - SGD4,750 Per Month
Singapore
- The Department of Electrical and Computer Engineering (ECE) at the National University of Singapore (NUS) is seeking a Research Engineer to support the development of a detachable fiber array unit (FAU) for co-packaged optics (CPO) systems. The role will focus on process and/or testing. Candidates will contribute to the design, fabrication, assembly, testing, and validation of flexible optical coupling structures and standardized optical interfaces for FAU integration in CPO systems. The work will be closely linked with simulation-driven design and optimization using tools such as ANSYS Multiphysics and/or COMSOL Multiphysics. This is an exciting opportunity to work at the forefront of semiconductor photonics and advanced optical packaging in close collaboration with industry partners and academic researchers.
- Responsibilities will include:
- Fabrication & Process Development• Fabrication of the FAU with high V-groove pitch accuracy and uniform array flatness.• Fabricate optical coupling configurations, including vertical and/or edge coupling. • Fabricate mechanically constrained FAU interfaces using precision-defined contactor-target geometries.• Optimize low-expansion adhesive systems that preserve optical attachment.2. Testing & Validation• Validate FAU fiber-capacity performance by examining array pitch accuracy, fiber placement repeatability, and coupling uniformity.• Characterize fabricated optical coupling samples by measuring beam profile, coupling efficiency, insertion loss, return loss, and misalignment tolerance.• Perform mechanical characterization to study FAU alignment stability, including contact deformation, preload response, and positional repeatability during repeated engagement.• Conduct thermal and reattachment-focused validation by examining drift over thermal cycles.3. Project Management & Collaboration• Contribute research milestones in alignment with project objectives and timelines.• Support technical reports, publications, and presentations for both academic and industry audiences.4. Innovation & Intellectual Property• Assist in patent filings, technology disclosures, and commercialization efforts. ...
Posted
17 days ago
Advanced Packaging Central Planning: Strategic-Scenario Planning Principal Engineer Advanced Packaging Central Planning: Strategic-Scenario Planning Principal Engineer
MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.
SGD7,000 - SGD7,000 Per Month
Singapore
- Own long-range space and footprint demand planning, translating product/technology roadmaps into expansion pathways (site and tooling mix, infrastructure readiness, and ramp phasing) under uncertainty.
- Recommend manufacturing strategies to inform senior leadership investment decisions by framing scenario-driven tradeoffs and providing clear guidance on capital allocation and prioritization (capex timing/scale and tooling plans) aligned to long-range business and technology objectives.
- Partner with Central teams, Manufacturing, Technology Development, Finance, and Product teams to align product roadmaps to capacity and capital plans ...
Posted
2 days ago
Undisclosed
Singapore
- Design FAU mechanical alignment structures that provide kinematic constraint in x- and y-axes and angular orientation.
- Select and optimize low-expansion adhesives that maintain optical alignment stability and allow corrective reattachment.
- Determine the required FAU capacity model, including wavelength tolerances, array flatness, thermo-optical, and thermo-mechanical interactions affecting optical alignment. ...
Posted
17 days ago
Undisclosed
Singapore
- Design FAU mechanical alignment structures that provide kinematic constraint in x- and y-axes and angular orientation.
- Select and optimize low-expansion adhesives that maintain optical alignment stability and allow corrective reattachment.
- Determine the required FAU capacity model, including wavelength tolerances, array flatness, thermo-optical, and thermo-mechanical interactions affecting optical alignment. ...
Posted
17 days ago
SGD7,000 - SGD7,000 Per Month
Singapore
- Translate customer requirements into internal equipment specifications.
- Develop and optimize TCB process parameters on TCB Equipments.
- Support advanced packaging applications including HBM, CoWoS, CoPoS, 2.5D Packaging, 3D Packaging and Chiplet Integration. ...
Posted
10 days ago
Undisclosed
- Pro-active collaboration in the global CoC and the related sub-CoC group (Center of Competence). Develop suitable strategies to execute governance over the core process within the area of regional responsibility defined for the BTC-AP BMI.
- Collaborate with R&D to promote the simultaneous engineering process for combined product and process development with the aim of generating manufacturable new products in accordance with the CoE’s and division’s needs.
- Conduct early evaluations of manufacturing technology suppliers in APAC region which would enhance B. Braun manufacturing capabilities, especially in the area of innovative automation technologies around the packaging processes. Provide training concepts and execution recommendations for technically skilled workers, to be implemented by a technical training center. ...
Posted
24 days ago
Undisclosed
Singapore
- Fabricate mechanically constrained FAU interfaces using precision-defined contactor-target geometries.
- Optimize low-expansion adhesive systems that preserve optical attachment.
- Testing & Validation ...
Posted
19 days ago
Undisclosed
Singapore
- Design FAU mechanical alignment structures that provide kinematic constraint in x- and y-axes and angular orientation.
- Select and optimize low-expansion adhesives that maintain optical alignment stability and allow corrective reattachment.
- Modeling & Simulation ...
Posted
19 days ago
Undisclosed
Singapore
- Work with advanced packaging materials including solder, epoxy, ceramics, and alloys
- Support customer sample builds and solve complex assembly/process challenges
- Develop process programs and optimize machine performance ...
Posted
a month ago
SGD7,000 - SGD7,000 Per Month
Singapore
- Strong knowledge of aseptic carton filling equipment and cap applicator systems
- Background as a Field Service Engineer or Technical Service Engineer and experience in beverage or liquid food manufacturing environments will be a huge plus
- Familiarity with HACCP, GMP, and food safety standards ...
Posted
24 days ago
SGD7,000 - SGD7,000 Per Month
Singapore
- Translate customer requirements into internal equipment specifications.
- Develop and optimize TCB process parameters on TCB Equipments.
- Support advanced packaging applications including HBM, CoWoS, CoPoS, 2.5D Packaging, 3D Packaging and Chiplet Integration. ...
Posted
10 days ago
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