- Maintain and upkeep test facilities and equipment
10 days
200+ Packaging Engineer Jobs in Malaysia | Job Vacancies | November 2026 | Ricebowl - Page 3
Showing 277 jobs results for
"packaging engineer"
- Drive the characterization of NPI product performances and yield including benchmark correlation to meet and/or exceed product cost targets
11 days
Software Packaging - Deployment Engineer
- Test software packages before deployment to ensure compatibility and compliance with packaging standards.
19 days
Product Marketing - Application Engineer (Advanced Packaging)
- Develop technical presentations, marketing materials, and customer-facing content for the Advanced Packaging market.
5 days
8 days
- Maintenance Strategy: Design, implement, and execute highly effective periodic and predictive maintenance programs for all production equipment to ensure consistent operational efficiency and yield.
17 days
- Work with internal design team and drive DFM methodology for new technologies.
12 days
Research Engineer - Senior Engineer – Advanced Packaging - Process Integration
- Develop and optimize process integration flows for advanced packaging technologies, including fan-out wafer-level packaging, 2.5D interposers, 3D stacking and heterogeneous integration.
3 days
Technical Services Engineer (Packaging Operations)
- Exposed to food quality requirements such as HACCP, GMP, GSFI, and ISO Systems.
22 days
Quality Engineer – Semiconductor Packaging
- Resolve non-conformance issues with supplied materials and follow up with suppliers for completion of corrective actions.
22 days
MTS - Advanced Packaging 2.5D and Deep Trench Integration Engineer
- Plan and execute test structures, process splits, and structured DOEs to establish process windows, understand module interactions, and retire technical risks.
12 days
Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering
- Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions
11 days
Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering
- Evaluate and promote new equipment and materials to enhance process capabilities
11 days
- Partner with OSATs to deliver assembly readiness for new product qualification. Key activities include BOM & process setup, risk analysis & mitigation, process characterization, lookahead assessment, qualification and CAB preparation leading to first part release
30+ days
Senior Packaging Development Engineer - Substrate Modules
- Collaborate closely with factory operations teams to meet manufacturing indices, quality standards, and cost entitlements
30+ days
Senior-Staff-Principal - Adv Pkg TD Integrator
- Identify path finding opportunities for Micron's technology leadership with BIC time to market, continuous yield improvement, cost efficiency & touchpoint optimizations
3 days
Principal Engineer Advanced Package Technology Development
- Lead multi-disciplinary technical teams and task forces to achieve strategic goals.
3 days
- Perform process qualifications according to internal and customer requirements.
5 days
Advanced Packaging Principle Integration Technologist (Principal Engineer, 10 years- experience) 1
- Leverage industry knowledge to identify process, equipment, and integration challenges
17 days
- Perform process qualifications according to internal and customer requirements.
8 days
- Perform process qualifications according to internal and customer requirements.
8 days
Sr. Package Engineer
- Lead or participate in cross-functional teams for new product introduction (NPI) and process improvement projects.
8 days
Principal Engineer - MTS, PDE Package Design
- Represent the packaging team in Silicon–package–board co-design by integrating floorplan, interface, interconnect, power, signal, thermal, and mechanical requirements, and resolve cost and manufacturing trade-offs to achieve a balanced package solution.
8 days
Senior Research Engineer II, IVR, VPD, Adv Pkg, IME
- Execute measurements across a range of operating conditions, including temperature-dependent, low-current, and low-voltage testing.
11 days
Staff-Principal, APTD CEM - Advanced Packaging Wafer Level Technology Engineering
- Evaluate and promote new equipment and materials to enhance process capabilities
11 days
- Responsible for internal/external package structure with designer, materials, assembly process flow and cost structure to meet the development goal.
12 days
SUPERVISOR (PACKAGING)
- Lead and manage the meal inventory control process for the packaging area and finished good.
12 days
Senior Packaging Development Engineer - Leadframe Package-Ceramic
- Collaborate closely with factory operations teams to meet manufacturing indices, quality standards, and cost entitlements
30+ days
Senior Associate Process Engineer - Package pick - place process
13 days
Staff - Senior Staff Engineer Package Technology Development
- Apply and verify design rules based on established baseline documents as well as specific equipment and process capability of specific assembly sites. This includes OSATs technical capability assessment support role.
17 days