Carry out risk assessments and identify technical challenges.
Assist with the qualification and setup of equipment for new bonding technologies, such as Die Attach, Clip Bond, and Reflow Oven.
Provide input for updating relevant documents and ensure their accuracy, including Process Specification, Assembly Design Rule, Process Roadmap, Failure Catalogue, Control Plan, FMEA, OJTI/WI, T32, etc., for development projects.
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