- Resizing & Formatting: Resize and adapt artwork for different platforms and formats.
7 days
75 Packaging Design Jobs in Malaysia | Job Vacancies | October 2026 | Ricebowl - Page 2
Showing 75 jobs results for
"packaging design"
Lead Advanced Packaging Design Engineer
- Collaborate with silicon design, design-for-test (DFT), signal integrity (SI), power integrity (PI), thermal, mechanical, and manufacturing teams to deliver optimized packaging solutions.
13 days
Part-Time Lecturer for DV5002 Packaging Design (ADM)
- The School of Art, Design and Media (ADM) at Nanyang Technological University, Singapore, invites qualified candidates to apply as Part-time Lecturer for DV5002 Packaging Design. The Part-time Lecturer is expected to teach an undergraduate course commencing in January 2027.
5 days
Part-Time Lecturer for DV5002 Packaging Design (ADM)
6 days
Part-Time Lecturer for DV5002 Packaging Design (ADM)
6 days
- S. in Mechanical Engineering plus 5 years, of relevant industry experience.
4 days
- Execute end-to-end design (static & motion) with strong conceptual thinking and meticulous execution.
30+ days
- Execute end-to-end design (static & motion) with strong conceptual thinking and meticulous execution.
30+ days
- S. in Mechanical Engineering plus 5 years, of relevant industry experience
18 days
- S.in Mechanical Engineering plus 5years,of relevant industry experience
18 days
- Execute end-to-end design (static & motion) with strong conceptual thinking and meticulous execution.
30+ days
- Execute end-to-end design (static & motion) with strong conceptual thinking and meticulous execution.
30+ days
- Execute end-to-end design (static & motion) with strong conceptual thinking and meticulous execution.
30+ days
Graphic Designer - Packaging, Product Development - Creative Design
- Design and develop packaging artworks (pouches, boxes, labels, etc.) in accordance with brand guidelines and regulatory requirements
22 days
- Lead package evaluation and qualification for NAND and ASIC technologies.
5 days
Senior-Staff-Principal - Adv Pkg TD Integrator
- Identify path finding opportunities for Micron's technology leadership with BIC time to market, continuous yield improvement, cost efficiency & touchpoint optimizations
10 days
Principal Engineer Advanced Package Technology Development
- Lead multi-disciplinary technical teams and task forces to achieve strategic goals.
10 days
Graphic - Packaging Designer (Sundries)
- Strong organizational and communication skills
12 days
- Lead package evaluation and qualification for NAND and ASIC technologies.
18 days
- Partner with Packaging R&D organizations worldwide to define, develop, and qualify next generation and emerging packaging technologies in alignment with long term business strategy and product roadmaps
18 days
Packaging Engineer (AI-ML)
- Develop and implement process improvement initiatives using methodologies such as Six Sigma and Lean.
18 days
- Partner with Packaging R&D organizations worldwide to define, develop, and qualify next generation and emerging packaging technologies in alignment with long term business strategy and product roadmaps
18 days
External Package Innovation Engineer
- Develop and maintain technology roadmap and capability assessment for each OSAT site
19 days
- Lead package evaluation and qualification for NAND and ASIC technologies.
20 days
Senior Packaging Designer — Grit - Pearl
22 days
2027 Packaging Engineer
- Conduct electrical, mechanical, thermal models to comprehend silicon-to-package interaction, establish design rules, and to predict and prevent the use of high risk designs.
23 days
Internship - Package Concept Team
- Dashboard Development: Work on a dashboard for package selection.
25 days
IC Packaging Engineer – Semiconductor
22 days
- Work closely with IC design, physical design, PCB, SI/PI, thermal, and manufacturing teams throughout the product development cycle.
18 days