Collaborate with silicon design, design-for-test (DFT), signal integrity (SI), power integrity (PI), thermal, mechanical, and manufacturing teams to deliver optimized packaging solutions.
Partner with Packaging R&D organizations worldwide to define, develop, and qualify next generation and emerging packaging technologies in alignment with long term business strategy and product roadmaps
Partner with Packaging R&D organizations worldwide to define, develop, and qualify next generation and emerging packaging technologies in alignment with long term business strategy and product roadmaps