Lead and coordinate customer complaint investigations using a structured approach, including root cause analysis, corrective and preventive actions, and effectiveness verification.
Plan, execute, and coordinate internal audits (ISO, 5S, Safety, etc.), including audit scheduling, audit execution, report preparation, and follow-up of corrective actions.
Act as key coordinator and site representative for second-party and third-party audits, including preparation of audit documents, escorting auditors, and tracking audit findings.
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Solid background in applied mechanics, especially computational and/or experimental solid mechanics, is required. In-depth knowledge of IC packaging is highly desired.
Ph.D. in Mechanical Engineering plus >3 year, or M.S. in Mechanical Engineering plus >5 years
Solid knowledge through academic coursework or experience required in mechanical engineering of IC packaging and related areas.
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Design SSD (Solid-State Drive) assembly jigs / fixtures by developing new concepts, performing reverse engineering, and creating mechanical drawings to support daily mechanical assembly and technical staging activities.
Oversee the development and implementation of comprehensive Product Qualification Packages during the development phase, encompassing product specifications, packaging requirements, mechanical drawings, supplier Design for Manufacturability (DFM) guidelines, and Quality Management Plans (QMP) for each qualified product.
Spearhead specialized engineering characterization activities, lead strategic cost reduction projects, and provide critical support for factory emergency taskforce operations as required.
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Inhouse Tester (SHRACKU) Ownership: Lead the development, integration, and maintenance of inhouse test platform (SHRACKU), focusing on Linux-based control, network IP, and USB protocol validation to ensure test stability and scalability in HVM.
Technical Expertise and Support: Provide leadership and execute technical support in electrical failure analysis (EFA), exploring new test method/EFA technique to address RMAs, production, reliability, and DPPM improvement. Analyze test results and deliver reports to stakeholders with actionable insights for improvement.
Technical Communication and Documentation: Develop and deliver clear, concise technical reports and documentation, including EFA, work instructions, test equipment guidelines, test reports, and specifications.
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Champion Innovation and Cost Efficiency: Collaboratively integrate advanced testing technologies, research, and adopt cost-saving solutions like Test Time Reduction (TTR) and new test platforms, driving CAPEX reduction. Continuously improve test programs and test infrastructure to enhance product quality and reliability.
Technical Expertise and Support: Provide leadership in electrical failure analysis (EFA), exploring new test method/EFA technique to address RMAs, production, reliability, and DPPM improvement. Analyze test results and deliver reports to stakeholders with actionable insights for improvement.
Technical Communication and Documentation: Develop and deliver clear, concise technical reports and documentation, including EFA, work instructions, test equipment guidelines, test reports, and specifications.
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Assist to ensure the most efficient and economical operations of Building, Facility and Equipment, hospital assets and equipment by ensuring effective implementation of Planned Preventive Maintenance (PPM) programs as per industrial requirements.
Ensure implementation and success of predictive and corrective maintenance practices leading to the best practices, attend to complaints and work requests within stipulated time.
Ensure continuous Uptime - Building, Facility System and Equipment.
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Drive supplier resolution of device failures via the 8D method and valid the effectiveness of CAPA.
Coordinate with Program Management, Design Engineering, Procurement and Factory for successful program execution with multiple suppliers, making recommendations on supplier selection.
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Advanced Model Development: Design and optimize state-of-the-art deep learning models for classification, object detection, and segmentation (e.g., YOLO, transformers, custom CNNs).
Data Infrastructure Leadership: Build, scale, and maintain high-throughput image processing and IoT data pipelines handling massive machine and sensor datasets.
Root Cause & Predictive Analytics: Spearhead advanced data analysis and deep-dive root cause investigations to solve critical manufacturing anomalies and drive continuous process yield improvement.
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