You will collaborate with other Dexcom teams to develop requirements, design criteria, and testing procedures
You will develop new and maintain existing automation applications and virtual machine servers based on Inductive Automation’s Ignition platform.
You will support manufacturing operations by investigating and solving application issues involving process data collection and integration with other systems.
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This position will interface with package and product design (in particular, thermal and mechanical), reliability, failure analysis, assembly R&D, and process teams to define material requirements and solutions. Collaborate with suppliers to develop, optimize, and qualify materials for successful production integration.
Master’s, or PhD in Materials Science or related engineering field.
Minimum 5 years of experience in semiconductor packaging, materials engineering, or related industries.
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To report and inform supervisor if there is any non-conformance or abnormality found during the processing.
To assist as required with the loading/unloading of vehicles as per shipping advise and general movements of goods around the site and processing onto the machine.