Support the complete product life cycle (Design updates, Creation of product specifications, 3D/2D modeling, Prototyping, Product testing, Product qualification, Project Execution & Sustaining till product end of life)
Knowledgeable in the Die preparation, Back Grinding, Sawing and machine troubleshooting with any additional wafer equipment knowledge. Qualifications REQUIRED:
Own assigned deliverables throughout the software development lifecycle, including design, implementation, integration, troubleshooting, and deployment.