100+份Semiconductor工作在Bayan Lepas - September 2026

显示119个工作的结果 "semiconductor" Bayan Lepas
不要错过任何 Semiconductor 的新工作机会 在 Bayan Lepas
MYR2,300 - MYR3,500 每月
  • Diploma in Mechatronics, Electrical, Electronic Engineering, or a related field.
  • Basic knowledge of industrial equipment maintenance and troubleshooting.
  • Able to read and follow technical drawings, schematics, and work instructions. ...
Equipment Maintenance Troubleshooting
+1

最后机会申请此工作。

Posted
4 days ago
MYR2,600 - MYR4,000 每月
  • Minimum SPM / O-Level, Professional Certificate, Diploma, Advanced Diploma, Higher Diploma, or Graduate Diploma.
  • At least 1–3 years of working experience as a Production Supervisor in the semiconductor industry.
  • Able to communicate in Mandarin. ...
Production Management Supervision
+1

最后机会申请此工作。

Posted
4 days ago
Undisclosed
  • Employment Type : Full time
  • Fluent in English, and Bahasa Malaysia.
  • Employment Type : Full time ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Education Requirement:
  • Additional Desirable Qualifications:
  • Education Requirement: ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Degree in Mechanical & Electrical Engineering / Mechatronic Engineering / Electrical & Electronics Engineering.
  • At least 1-2 years of experience in relevant fields.
  • Familiar with equipment operation and know basic maintenance of production equipment/machine. ...
Posted
a month ago
Undisclosed
  • Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
  • Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
  • Education Requirement: ...
Posted
a month ago
Undisclosed
  • Qualification & Experience: Diploma holder in Engineering or any related discipline. Relevant working experience is preferred.
  • Employment Type : Full time
  • Fluent in English, and Bahasa Malaysia. ...
Posted
a month ago
Undisclosed
  • Diploma or any certificated related discipline with 3 years working experience.
  • Job Overview:
  • To ensure the product or material tested meeting the customer requirements with good quality and production ...

最后机会申请此工作。

Posted
20 days ago
Undisclosed
  • Perform conversion at least 2 models of Pick & place handlers.
  • Setup test equipment within allocated time period without compromising quality.
  • Immediately report any quality/ major issues encountered to Module Leader for next course of action ...

最后机会申请此工作。

Posted
20 days ago
Undisclosed
  • To support wire bond process engineering works and carry out yield, quality, cost savings, productivity improvements and documentation.
  • Degree in related discipline with min 5 years relevant working experience or graduate with the degree in any Electronics, Electrical, Mechanical or Mechatronics engineering course.
  • Job Overview: ...
Troubleshooting process engineering
+1

最后机会申请此工作。

Posted
20 days ago
Undisclosed
  • Experienced in AOI process and able to perform troubleshooting, set-up, conversion and recipe creation.
  • Employment Type : Full time
  • Fluent in English, and Bahasa Malaysia. ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Employment Type : Full time
  • Fluent in English, and Bahasa Malaysia.
  • Employment Type : Full time ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Qualification & Experience: Diploma holder in Engineering or any related discipline. Relevant working experience is preferred.
  • Employment Type : Full time
  • Fluent in English, and Bahasa Malaysia. ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Minimum qualification is a Diploma in Electronics/Microelectronics.
  • The candidate should have Failure Analysis experience in Package or Die level FA or Reliability analysis experience for a minimum of 1 year and above in semiconductor manufacturing related company.
  • Well versed in using FA & Rel related equipment such as Microscope, Parametric Analyzer, X-ray, CSAM, SEM-EDX, Decapper, TDR, Micro Prober station, FTIR, HAST, Bake oven, Reflow machine, TC chamber, Burn in oven and etc. ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
  • Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
  • Education Requirement: ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Diploma in related discipline with min 3 years relevant working experience or ;
  • Technical Cert with min 4 years relevant working experience or ;
  • SPM / SPMV with min 5 years relevant working experience. ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Degree in related discipline or Diploma with 4 years relevant working experience.
  • Degree in related discipline or Diploma with 4 years relevant working experience.
  • Job Overview : ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Candidate must possess at least a Bachelor’s degree / Professional Accounting Qualification or equivalent
  • Minimum 3 years in handling costing and manufacturing cost accounting. Fresh graduate welcome to apply.
  • Mandarin speakers are preferred due to job-related. ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Diploma in Electrical/Electronic/Mechanical.
  • Minimum 2 years working experiences in related field.
  • Experience in Package Saw process. ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Diploma in Electrical/Electronics/Mechanical Engineering.
  • Basic knowledge in Molding process (Hydraulic and servo system,)
  • Able to read schematic diagram. ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Experienced in Wirebond process and able to perform troubleshooting, set-up, conversion and recipe creation.
  • Employment Type : Full time
  • Fluent in English, and Bahasa Malaysia. ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Degree in related discipline or Diploma with 3 years related working experience.
  • Employment Type : Full time
  • Fluent in English, and Bahasa Malaysia. ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Experienced in Wirebond process and able to perform troubleshooting, set-up, conversion and recipe creation.
  • Employment Type : Full time
  • Fluent in English, and Bahasa Malaysia. ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Experienced in Wirebond process and able to perform troubleshooting, set-up, conversion and recipe creation.
  • Employment Type : Full time
  • Fluent in English, and Bahasa Malaysia. ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Experienced in Wirebond process and able to perform troubleshooting, set-up, conversion and recipe creation.
  • Employment Type : Full time
  • Fluent in English, and Bahasa Malaysia. ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Education Requirement:
  • Degree in Electronics / Electrical /Chemical/Mechanical Engineering
  • Additional Desirable Qualifications: ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Experienced in Wirebond process and able to perform troubleshooting, set-up, conversion and recipe creation.
  • Employment Type : Full time
  • Fluent in English, and Bahasa Malaysia. ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Fresh graduate with degree holder of Bachelor of Science or Engineering.
  • NPI and Project Management experiences. Familiar with Semiconductor manufacturing processes.
  • Qualification & Experience : ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Degree in Mechanical/ Electronics / Electrical /Mechanical Engineering.
  • Min 2 years in semiconductor industry in the field of assembly engineering.
  • Experience in die/glass attach process. ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Degree in related discipline or Diploma with 3 years related working experience.
  • AutoCad application knowledge will be an advantage.
  • Qualification & Experience: ...

最后机会申请此工作。

Posted
a month ago