Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
Site Supervision
Construction Management
Team Leadership
Quality Control
Safety Regulations
Problem Solving
Blueprint Reading
Budget Management
Communication Skills
Time Management
Risk Assessment
Minimum qualification is a Diploma in Electronics/Microelectronics.
The candidate should have Failure Analysis experience in Package or Die level FA or Reliability analysis experience for a minimum of 1 year and above in semiconductor manufacturing related company.
Well versed in using FA & Rel related equipment such as Microscope, Parametric Analyzer, X-ray, CSAM, SEM-EDX, Decapper, TDR, Micro Prober station, FTIR, HAST, Bake oven, Reflow machine, TC chamber, Burn in oven and etc.
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