To support wire bond process engineering works and carry out yield, quality, cost savings, productivity improvements and documentation.
Degree in related discipline with min 5 years relevant working experience or graduate with the degree in any Electronics, Electrical, Mechanical or Mechatronics engineering course.
Data Center Operations
Infrastructure Support
Network Cabling
Fiber Optics
Ethernet Switching
IP Addressing
VLAN
Cable Troubleshooting
Hardware Installation
Server Racking
Cable Management
Windows 10
Windows 11
Windows Server 2019
Windows Server 2022
VMware vSphere
Microsoft Failover Cluster
Microsoft NLB Cluster
Troubleshooting
Customer Service
Microsoft Office Suite
ServiceNow
Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
Bachelor’s degree or higher in Material Science, Physics, Mechanical, or Chemical Engineering, or equivalent.
Knowledge of analytical tools such as Parametric Analyzer, Keithley Meter, TDR, EOTPR, SEM/EDX, FIB, FTIR, X-Ray, Acoustic Imaging, and IR Imaging tools.
Strong analytical thinking and problem-solving skills.
...
Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.