Experience: Minimum 5+ years in VAVE purchasing and project purchasing, with a proven track record of delivering cost-down projects. HVAC industry experience strongly preferred.
Demonstrated ability to manage multiple cost-down projects simultaneously, from concept through realization.
Strong understanding of BOM structures, ECN/PCN processes, change management, and supplier development.
...
Diploma or Degree in Mechanical Engineering or related Technical disciplines.
Minimum 3 years of design experiences in semiconductor machines or automations.
Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus.
...
CAD software (e.g.
AutoCAD
SolidWorks
Inventor)
2D and 3D drafting
Geometric Dimensioning and Tolerancing (GD&T)
Mechanical design principles
Technical drawing interpretation
Collaboration with engineers and manufacturing teams
Manufacturing processes
Diploma or Degree in Mechanical Engineering or related Technical disciplines.
Minimum 3 years of design experiences in semiconductor machines or automations.
Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus.
...
CAD software (e.g.
AutoCAD
SolidWorks
Inventor)
2D and 3D drafting
Geometric Dimensioning and Tolerancing (GD&T)
Mechanical design principles
Technical drawing interpretation
Collaboration with engineers and manufacturing teams
Manufacturing processes
Diploma or Degree in Mechanical Engineering or related Technical disciplines.
Minimum 3 years of design experiences in semiconductor machines or automations.
Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus.
...
CAD software (e.g.
AutoCAD
SolidWorks
Inventor)
2D and 3D drafting
Geometric Dimensioning and Tolerancing (GD&T)
Mechanical design principles
Technical drawing interpretation
Collaboration with engineers and manufacturing teams
Manufacturing processes
Diploma or Degree in Mechanical Engineering or related Technical disciplines.
Minimum 3 years of design experiences in semiconductor machines or automations.
Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus.
...
CAD software (e.g.
AutoCAD
SolidWorks
Inventor)
2D and 3D drafting
Geometric Dimensioning and Tolerancing (GD&T)
Mechanical design principles
Technical drawing interpretation
Collaboration with engineers and manufacturing teams
Manufacturing processes
Diploma or Degree in Mechanical Engineering or related Technical disciplines.
Minimum 3 years of design experiences in semiconductor machines or automations.
Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus.
...
CAD software (e.g.
AutoCAD
SolidWorks
Inventor)
2D and 3D drafting
Geometric Dimensioning and Tolerancing (GD&T)
Mechanical design principles
Technical drawing interpretation
Collaboration with engineers and manufacturing teams
Manufacturing processes
Diploma or Degree in Mechanical Engineering or related Technical disciplines.
Minimum 3 years of design experiences in semiconductor machines or automations.
Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus.
...
CAD software (e.g.
AutoCAD
SolidWorks
Inventor)
2D and 3D drafting
Geometric Dimensioning and Tolerancing (GD&T)
Mechanical design principles
Technical drawing interpretation
Collaboration with engineers and manufacturing teams
Manufacturing processes