Solid background in applied mechanics, especially computational and/or experimental solid mechanics, is required. In-depth knowledge of IC packaging is highly desired.
Use of Six Sigma, Lean, and Mistake proof methodologies in the development of manufacturing processes to implement processes that are ‘born lean and capable’.
Assess semiconductor reliability risks and interpret qualification and reliability test results to support device, technology and supplier qualification.
Assess semiconductor reliability risks and interpret qualification and reliability test results to support device, technology and supplier qualification.
Assess semiconductor reliability risks and interpret qualification and reliability test results to support device, technology and supplier qualification.