Provide deep technical leadership in areas such as infrastructure, network, identity, automation, observability, backup, security, compliance, developer enablement, CI/CD, platform operations, and data and AI services.
Manage the maintenance system, maintenance activities, and maintenance personnel for Die Attach and Oven assembly equipment to achieve optimal equipment efficiency and cost effectiveness
Manage the maintenance system, maintenance activities, and maintenance personnel for Wire Bond Assembly and Plasma equipment to achieve maximum equipment efficiency and cost effectiveness
Provide inputs for updating of related documents and is responsible for their correct contents, eg Process of Record, Assembly Design Rule, Process Roadmap, Failure catalogue, Control Plan, Maintenance checklist, Unit process roadmap for development projects.
Continuously enhance your technical expertise in the area of base material, metallization, chip frontside passivation and frontend/backend interaction topics
Drive hands-on design evaluation, hardware validation, first article assessment, debug, documentation, and release-to-production activities for wafer test hardware
Collaborate with suppliers on continuous improvement initiatives and perform verification and qualification activities for new materials, tooling, and equipment used in development projects.
Develop qualification plan for test solution as well as qualify and implement new test solution into production according to standard business process (e.g. TT, TE)
Manage the maintenance system, maintenance activities, and maintenance personnel for Die Bond and Oven assembly equipment to achieve optimal equipment efficiency and cost effectiveness.
Manage the maintenance system, maintenance activities, and maintenance personnel for Wire Bond Assembly and Plasma equipment to achieve maximum equipment efficiency and cost effectiveness.