Collaborate with cross-functional stakeholders including design engineers, device engineers, manufacturing partners, and quality teams to resolve complex technical challenges.
Define and refine product specifications, test algorithms, and stress screening methods based on rigorous data analysis and industry best practices.
Monitor product quality metrics and reliability performance across product lines, driving continuous improvement initiatives and process optimization.
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This position will interface with package and product design (in particular, thermal and mechanical), reliability, failure analysis, assembly R&D, and process teams to define material requirements and solutions. Collaborate with suppliers to develop, optimize, and qualify materials for successful production integration.
Master’s, or PhD in Materials Science or related engineering field.
Minimum 5 years of experience in semiconductor packaging, materials engineering, or related industries.
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Lead or support investigations on nonconforming products, customer complaints, and manufacturing defects; implement corrective and preventive actions (CAPA)
Review and develop validation and test protocols; execute qualification and validation activities with proper documentation
Participate in new product introductions, technology transfers, and evaluation of new equipment and processes
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