Knowledge of high-speed design concepts, including differential signaling, clock distribution, power/ground routing, shielding, and layout techniques for minimizing jitter and crosstalk.
Understanding of semiconductor manufacturing processes and design-for-manufacturability (DFM) practices relevant to Serdes and mixed-signal circuits.
Effective communication and collaboration abilities, including working closely with circuit design, verification, and physical design teams in a multicultural environment.
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Review manufacturing readiness including process capability, tooling, equipment, materials, capacity, and documentation.
Identify and drive closure of technical, operational, quality, and cost-related gaps prior to production release.
Coordinate with Product Engineering, Quality, Manufacturing, Equipment Engineering, and Supply Chain teams to ensure successful product introductions.
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Malaysia Semiconductor Recruitment Day (MSRD) 2026 brings together 70+ semiconductor companies, 1,000+ job opportunities, and 40+ industry speakers under one platform, connecting talents with employers across the semiconductor industry in KLCC on 14-17 Oct 2026.
Ahead of the event, we are featuring selected openings from participating employers to help candidates discover available opportunities and identify roles that match their experience and career interests. Submit your resume for relevant opportunities, and join us at MSRD 2026 to meet participating employers and explore more career openings.
Strong knowledge in electrical, mechanical, pneumatic, motion and temperature controllers will be added advantage.
Conducts and initiates spare parts review and cost saving initiatives without sacrificing maintenance, quality and equipment up time.
Actively involved in the review of new equipment design, hardware and instruments purchases. Perform machine buyoff at supplier site and in house machine commissioning.
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Develop expertise in how TE products are applied based on Customer’s manufacturing processes. Translates customer’s assembly process to TE product design teams, assisting with crafting TE Application Spec documents. Collaborates early and aligns with customers on TE’s final Application Spec. Conducts signoff review between TE and Customer for NPI products.
Works with TE engineering to integrate customer application parameters into TE product and application specifications.
Provides internal training to TE product and FAE groups showing new process technologies that our customer base is utilizing or experimenting with for future development.
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Develop expertise in how TE products are applied based on Customer’s manufacturing processes. Translates customer’s assembly process to TE product design teams, assisting with crafting TE Application Spec documents. Collaborates early and aligns with customers on TE’s final Application Spec. Conducts signoff review between TE and Customer for NPI products.
Works with TE engineering to integrate customer application parameters into TE product and application specifications.
Provides internal training to TE product and FAE groups showing new process technologies that our customer base is utilizing or experimenting with for future development.
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Ability to work with local FAE and product engineering teams on new concepts.
Develop expertise in how TE products are applied based on Customer’s manufacturing processes. Translates customer’s assembly process to TE product design teams, assisting with crafting TE Application Spec documents. Collaborates early and aligns with customers on TE’s final Application Spec. Conducts signoff review between TE and Customer for NPI products.
Works with TE engineering to integrate customer application parameters into TE product and application specifications.
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