Help execute activities that support manufacturing readiness, including test flow validation, documentation updates, and coordination with partner teams.
Yield & Failure Analysis– Experience analysing wafer sort, assembly, and final test data to identify yield issues, correlate failures across manufacturing stages, and determine root causes.
Root Cause and Resolution of Qual and RMA Device Issues pertaining to defectivity and intrinsic reliability: Debug and identify root cause and failures in reliability tests by electric failure analysis(EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration.
Responsible for analyzing, defining, developing, and executing continuous improvement plans to achieve yield, cycle time, throughput, and scrap reduction.
Root Cause and Resolution of Qual and RMA Device Issues pertaining to defectivity and intrinsic reliability: Debug and identify root cause and failures in reliability tests by electric failure analysis(EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration.
To collaborate with Factory Engineering to resolve product-related manufacturing issue, BOM setup, product flow definition and non-confirming material disposition.
Root Cause and Resolution of Qual and RMA Device Issues pertaining to defectivity and intrinsic reliability: Debug and identify root cause and failures in reliability tests by electric failure analysis(EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration.