Core Technical Competencies: Strong fundamental knowledge of material characterization, thin-film mechanics, fluid dynamics, or semiconductor physics. Familiarity with SPC, DOE, and Minitab is highly preferred.
Language Capabilities: Fluent and articulate command of both written and spoken English.
Engineering DOEs and Statistical Analysis:Conduct Design of Experiments (DOEs) and apply statistical analysis methods to solve complex problems, making data-driven decisions.
Process Setup and Improvement:Recipe knowledge, Set up and continuously improve assembly processes, specifically focusing on die Attach equipment
Excursion and Abnormal Case Management:Manage production line excursions and abnormal cases, ensuring swift and effective resolution.
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Collect information required to establish or revise work instruction. Ensure related work instructions are available in each workstation with proper filing.
Support tasks to establish and revise SOP for engineering department. Ensure all SOPs are available in specified area and well acknowledged by related personnel.
Establish proper filing for engineering ISO form while maintaining form used is in its’ latest revision and keeping all record up to date.
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Responsible for meeting KPIs and lead continuous improvements projects to improve them (OEE, FPY, TPY, DPMO, On-time delivery, cost targets etc)
New technology research and evaluation on cutting edge manufacturing technology to meet products requirements and improve manufacturing process. Facilitates decision making for setting manufacturing policies and future strategy.
Design and defines processes that are sustainable and reproducible
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Lead manufacturing issue resolution, implement corrective and preventive actions, and support quality activities from incoming inspection through shipping.
Establish equipment maintenance and calibration processes while identifying and implementing new manufacturing technologies.
Bachelor's degree in Electrical, Mechanical, Mechatronics, Materials Science, Industrial Engineering, or a related field, with at least 4 years of relevant manufacturing experience.
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Develop and set up new Flip Chip Attach processes, including recipe setup and optimization, process window studies, Design of Experiments (DOE), and Corner limit validations.
Drive and establish Golden Recipe configurations for new package qualifications.
Maintain and standardize FCA recipe templates in accordance with Positrol log guidelines.
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Develop expertise in how TE products are applied based on Customer’s manufacturing processes. Translates customer’s assembly process to TE product design teams, assisting with crafting TE Application Spec documents. Collaborates early and aligns with customers on TE’s final Application Spec. Conducts signoff review between TE and Customer for NPI products.
Works with TE engineering to integrate customer application parameters into TE product and application specifications.
Provides internal training to TE product and FAE groups showing new process technologies that our customer base is utilizing or experimenting with for future development.
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Develop expertise in how TE products are applied based on Customer’s manufacturing processes. Translates customer’s assembly process to TE product design teams, assisting with crafting TE Application Spec documents. Collaborates early and aligns with customers on TE’s final Application Spec. Conducts signoff review between TE and Customer for NPI products.
Works with TE engineering to integrate customer application parameters into TE product and application specifications.
Provides internal training to TE product and FAE groups showing new process technologies that our customer base is utilizing or experimenting with for future development.
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Ability to work with local FAE and product engineering teams on new concepts.
Develop expertise in how TE products are applied based on Customer’s manufacturing processes. Translates customer’s assembly process to TE product design teams, assisting with crafting TE Application Spec documents. Collaborates early and aligns with customers on TE’s final Application Spec. Conducts signoff review between TE and Customer for NPI products.
Works with TE engineering to integrate customer application parameters into TE product and application specifications.
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Work together with NPI, Fixture Designer, CADCAM Programmer and Production to support new product development and proposal for DFMA (Design for Manufacturing and Assembly).
Support NPI for new products feasibility study and advise on required product cleaning workflow and packaging processes till realization.
In-charge for contamination control and pre-packing of products.
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Support NPI for new products feasibility study and provide Cleaning & Anodization Process cycle time for costing purpose.
Lead problem solving: defining the problem, identifying objectives, assessing risk, developing approach, analyzing results, implement corrective actions and effectively communicate those actions to all required personnel.
Maintain all the physical and chemical parameter of the process within SPEC.
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Monitoring on hold lot disposition and provide communication with engineer in order to not impact daily assembly output.
Maintain all housekeeping / 5s engineering station and tooling’s, to ensure compliance to safety rules.
Monitor all processes, resolve all products issues and coordinate with production and equipment to reduce downtime and getting better product quality.
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