Monitor and control key KPIs including wafer thickness uniformity, die strength, chipping, cracking, mold voids, warpage, package yield, and defectivity.
Perform rapid troubleshooting, root cause analysis, and corrective actions to maintain tool uptime and process stability.
Handle general clerical duties of Production Planning Department, including data entry, update information, filing and prepare production documentation system etc.
Maintain the documentation system and other production documents.
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