4 Packing Jobs in Batu - June 2026

This position will interface with package and product design (in particular, thermal and mechanical), reliability, failure analysis, assembly R&D, and process teams to define material requirements and solutions. Collaborate with suppliers to develop, optimize, and qualify materials for successful production integration.
Master’s, or PhD in Materials Science or related engineering field.
Minimum 5 years of experience in semiconductor packaging, materials engineering, or related industries. ...

Posted

3 days ago

Sandisk

Undisclosed

Support chip structure optimization through detailed FA results and recommendations.
Evaluate package reliability and robustness in response to fab process changes.
Support package evaluation and qualification for NAND and ASIC technologies. ...

Posted

3 days ago