Ability to perform assembly equipment conversion and major troubleshooting to ensure smoothed production line.
This role requires reliable presence to support operational and team objectives. Employees are expected to maintain regular attendance aligned with the company’s work schedule.
Certificate / Diploma in Electrical & Electronic / Mechatronic or equivalent field.
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Provide inputs for updating of related documents and responsible for their correct contents, e.g. Process of Record, Assembly Design Rule, Process Roadmap, Failure Catalogue, Control Plan, Maintenance checklist,etc. for development projects.
Liaise with suppliers for continuous improvement and perform verification and qualification activities for new tooling, machines and materials in development projects.
Participate and support problem solving team using statistical and analytical tools, e.g. SPC, APC, DOE, 8D, FMEA, DFMEA.
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Design and execute DOE plans to characterize thermal and mechanical stress. Lead reliability validations including Temperature Cycling Test (TCT), Unbiased Highly Accelerated Stress Test (HAST) and High-Temperature Storage (HTS).
Failure Analysis & Debug: Own the root-cause diagnostics of structural failure modes unique to WLCSP (e.g., RDL cracking, bridging ball bridging, bump missing, delamination, or wafer warpage). Utilize specialized analytics instrumentation including SEM, CSAM, and physical cross-sectioning. Conduct root cause analysis and formulate improvement solutions.
Optimize key bumping process parameters including wafer cleaning, UBM sputtering, solder ball plating, reflow and bump inspection to improve bump uniformity and yield.
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