Lead the design, development, optimization, and validation of software and hardware applications for advanced die bonding processes.
Analyze customer requirements and translate them into customized semiconductor packaging solutions, focusing on process optimization and application performance....
Pro-active collaboration in the global CoC and the related sub-CoC group (Center of Competence). Develop suitable strategies to execute governance over the core process within the area of regional responsibility defined for the BTC-AP BMI.
Collaborate with R&D to promote the simultaneous engineering process for combined product and process development with the aim of generating manufacturable new products in accordance with the CoE’s and division’s needs.
Conduct early evaluations of manufacturing technology suppliers in APAC region which would enhance B. Braun manufacturing capabilities, especially in the area of innovative automation technologies around the packaging processes. Provide training concepts and execution recommendations for technically skilled workers, to be implemented by a technical training center....
Monitor equipment, operate control, process samples, adjust machine processes using selectivity and judgement and utilize computer systems to input and record data.
Set up and operate control systems for a series of machines requiring interaction of several variables.
Understand and adhere to all safety policies and procedures....