Expected to acquire first-level troubleshooting capabilities
Follow structured diagnostic approaches and established workflows
Maintain clear, accurate and structured records of troubleshooting incidents that meet manufacturing-grade traceability standards and supports downstream analysis
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Monitor equipment, operate control, process samples, adjust machine processes using selectivity and judgement and utilize computer systems to input and record data.
Set up and operate control systems for a series of machines requiring interaction of several variables.
Understand and adhere to all safety policies and procedures.
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Monitor and control key KPIs including wafer thickness uniformity, die strength, chipping, cracking, mold voids, warpage, package yield, and defectivity.
Perform rapid troubleshooting, root cause analysis, and corrective actions to maintain tool uptime and process stability.
Partner with Packaging R&D organizations worldwide to define, develop, and qualify next generation and emerging packaging technologies in alignment with long term business strategy and product roadmaps
Drive enterprise level assembly yield improvement initiatives and package cost reduction programs, establishing best practices and measurable performance targets across supported product lines.
Own package technology roadmaps, oversee budgets for supported products, and guide the development of scalable packaging infrastructure to support future growth and technology transitions.
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