Provide technical leadership and mentorship to SI/PI, hardware, and packaging engineers, ensuring RF performance is preserved across the full signal chain, from chip package through PCB.
Test Hardware Integration: Collaborate with PCB and probe card designers to optimize test hardware for power and signal integrity at high speed (PCIe Gen6, HBM4, Maxphy, 400G+ SerDes). Actively debug hardware-software interface issues on the loadboard and probe card levels.
Carry out supervision and inspection C&S works including but not limited to concreting, pavement, drainage, compaction, curing of concrete, formwork, re-props and removal of props, quality & erection of precast components and steel works.