Ability to work with local FAE and product engineering teams on new concepts.
Develop expertise in how TE products are applied based on Customer’s manufacturing processes. Translates customer’s assembly process to TE product design teams, assisting with crafting TE Application Spec documents. Collaborates early and aligns with customers on TE’s final Application Spec. Conducts signoff review between TE and Customer for NPI products.
Works with TE engineering to integrate customer application parameters into TE product and application specifications.
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Be proactive in communicating effectively with multi-functional teams and multi-site to constantly optimize layout for better Power, Performance & Area (PPA).
Bachelor’s degree in Electrical, Electronic, or Material Science Engineering.
More than 2~7 years of hands-on experience in custom IC layout for Standard Cell, Memory Compiler or IO/ESD libraries using advanced finFET/GAA process nodes; candidates with Analog/RF experiences are welcomed to apply.
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