Lead and coordinate customer complaint investigations using a structured approach, including root cause analysis, corrective and preventive actions, and effectiveness verification.
Plan, execute, and coordinate internal audits (ISO, 5S, Safety, etc.), including audit scheduling, audit execution, report preparation, and follow-up of corrective actions.
Act as key coordinator and site representative for second-party and third-party audits, including preparation of audit documents, escorting auditors, and tracking audit findings.
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Lead and coordinate customer complaint investigations using a structured approach, including root cause analysis, corrective and preventive actions, and effectiveness verification.
Plan, execute, and coordinate internal audits (ISO, 5S, Safety, etc.), including audit scheduling, audit execution, report preparation, and follow-up of corrective actions.
Act as key coordinator and site representative for second-party and third-party audits, including preparation of audit documents, escorting auditors, and tracking audit findings.
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Facilitate Kaizen, Value Stream Mapping (VSM), and other related activities/workshops to promote a culture of continuous improvement and operational excellence.
Coach and mentor Green Belts and project teams to build organizational capability.
Partner with business leaders to identify and prioritize strategic improvement opportunities.
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Develop and set up new Flip Chip Attach processes, including recipe setup and optimization, process window studies, Design of Experiments (DOE), and Corner limit validations.
Drive and establish Golden Recipe configurations for new package qualifications.
Maintain and standardize FCA recipe templates in accordance with Positrol log guidelines.
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Solid background in applied mechanics, especially computational and/or experimental solid mechanics, is required. In-depth knowledge of IC packaging is highly desired.
Ph.D. in Mechanical Engineering plus >3 year, or M.S. in Mechanical Engineering plus >5 years
Solid knowledge through academic coursework or experience required in mechanical engineering of IC packaging and related areas.
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Inhouse Tester (SHRACKU) Ownership: Lead the development, integration, and maintenance of inhouse test platform (SHRACKU), focusing on Linux-based control, network IP, and USB protocol validation to ensure test stability and scalability in HVM.
Technical Expertise and Support: Provide leadership and execute technical support in electrical failure analysis (EFA), exploring new test method/EFA technique to address RMAs, production, reliability, and DPPM improvement. Analyze test results and deliver reports to stakeholders with actionable insights for improvement.
Technical Communication and Documentation: Develop and deliver clear, concise technical reports and documentation, including EFA, work instructions, test equipment guidelines, test reports, and specifications.
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Champion Innovation and Cost Efficiency: Collaboratively integrate advanced testing technologies, research, and adopt cost-saving solutions like Test Time Reduction (TTR) and new test platforms, driving CAPEX reduction. Continuously improve test programs and test infrastructure to enhance product quality and reliability.
Technical Expertise and Support: Provide leadership in electrical failure analysis (EFA), exploring new test method/EFA technique to address RMAs, production, reliability, and DPPM improvement. Analyze test results and deliver reports to stakeholders with actionable insights for improvement.
Technical Communication and Documentation: Develop and deliver clear, concise technical reports and documentation, including EFA, work instructions, test equipment guidelines, test reports, and specifications.
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