UNISEM (M) BERHAD Hiring! Full Time Process Engineer in Perak - Ricebowl

Requirements

Must Have

• Bachelor's Degree in Electronics, Mechanical, Mechatronics, Manufacturing Engineering, or a related discipline.
• Experience in semiconductor manufacturing or a similar process engineering role is preferred.
• Knowledge of process improvement methodologies, including DOE, SPC, and quality tools.
• Strong analytical, troubleshooting, and problem-solving skills.
• Able to work independently with minimal supervision.
• Good communication and interpersonal skills.
• Good command of written and spoken English.

Nice to Have

• Hands-on experience with Flip Chip, SMT, Backgrind, Wafer Saw, or Wafer AOI processes.
• Mandarin proficiency is an added advantage to support communication with Mandarin-speaking customers.

About Us

Unisem is a leading global provider of semiconductor assembly and test services, offering end-to-end packaging, testing, and engineering solutions to the world's top electronics companies. Headquartered in Kuala Lumpur, Malaysia, Unisem operates manufacturing facilities in Ipoh, Malaysia, and Chengdu, China, with approximately 6,000 employees worldwide.

What We Offer

·       Birthday Gift & Car Loan Subsidy Incentive

·       Attendance Incentive

·       Medical & Dental Benefits

Job Overview

We are looking for a motivated and detail-oriented Process Engineer to support semiconductor assembly operations at our Simpang Pulai or Gopeng, Perak facility. In this role, you will ensure process stability, troubleshoot manufacturing issues, optimize production processes, and drive continuous improvement to achieve high product quality and operational excellence.

Key Responsibilities

• Provide technical support and troubleshoot process-related issues in the semiconductor assembly line.
• Ensure manufacturing processes comply with Standard Operating Procedures (SOPs) and quality requirements.
• Monitor and analyze QA gate performance, SPC trends, yield data, and process performance to maintain product quality.
• Drive process optimization and continuous improvement through Design of Experiments (DOE), process validation, and machine capability studies.
• Investigate product defects, perform root cause analysis, and implement effective corrective and preventive actions (CAPA).
• Collaborate with cross-functional teams to improve manufacturing efficiency, yield, and product reliability.
• Support new process introduction, qualification, and ongoing process improvements.
• Experience in Flip Chip, SMT, Backgrind, Wafer Saw, or Wafer AOI processes is an added advantage.