- Yishun North Region (Singapore) Singapore
STATS ChipPAC Pte. Ltd. Hiring! Full Time Senior - Equipment Engineer in North Region (Singapore), Earn up to SGD 6,000 - Ricebowl
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Job Description
Responsibilities
About us
STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.
About the role
Manage AEs, sustain equipment performance, improve OEE, resolve line/quality issues, and drive yield, productivity and cost improvements.
Key responsibilities
Plan training program on new incoming line sustaining AE on the job function on set-up, conversion and equipment repair to support production loading.
Plan and develop machine parts stock available to minimize downtime on awaiting for parts delivery.
Review the OEE, machine utilization and FDC regularly to seek improvement on equipment.
Develop creative and innovative solutions to problems with considerable initiatives and independent thoughts.
Communicate with external vendors to resolve problems as line encounter and work on improvement.
Identify problems as well as areas for yield and quality improvements and develop methods to improve productivity and reduce manufacturing cost.
In-charge of ball drop, reflow, taping, detaping, wafer mounter, saw singulation process and open short and wafer probing testing.
Experience in backend assembly process is preferred.
What we're looking for
Diploma in Mechanical Engineering or equivalent.
Minimum with 3 – 5 years of relevant experience in wafer bumping for backend operations.
Join a leader in the industry!
STATS ChipPAC, a member of the JCET Group, is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services encompassing semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to customers around the world. Ranked as the third largest Outsourced Semiconductor Assembly and Test (OSAT) company, opportunities abound in growth and development as we continue to push towards new heights in this highly competitive field. Our comprehensive portfolio covers a wide spectrum of semiconductor applications servicing the telecommunications, consumer, automotive and other industries through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. Our global footprint spans over 2 top-notched R&D facilities and 6 manufacturing locations in the Asia Pacific region, with global sales outreach as our sales network provide close technology collaboration and efficient supply-chain manufacturing to our global customers.
Join us and expand your world.
STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.
About the role
Manage AEs, sustain equipment performance, improve OEE, resolve line/quality issues, and drive yield, productivity and cost improvements.
Key responsibilities
Plan training program on new incoming line sustaining AE on the job function on set-up, conversion and equipment repair to support production loading.
Plan and develop machine parts stock available to minimize downtime on awaiting for parts delivery.
Review the OEE, machine utilization and FDC regularly to seek improvement on equipment.
Develop creative and innovative solutions to problems with considerable initiatives and independent thoughts.
Communicate with external vendors to resolve problems as line encounter and work on improvement.
Identify problems as well as areas for yield and quality improvements and develop methods to improve productivity and reduce manufacturing cost.
In-charge of ball drop, reflow, taping, detaping, wafer mounter, saw singulation process and open short and wafer probing testing.
Experience in backend assembly process is preferred.
What we're looking for
Diploma in Mechanical Engineering or equivalent.
Minimum with 3 – 5 years of relevant experience in wafer bumping for backend operations.
Join a leader in the industry!
STATS ChipPAC, a member of the JCET Group, is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services encompassing semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to customers around the world. Ranked as the third largest Outsourced Semiconductor Assembly and Test (OSAT) company, opportunities abound in growth and development as we continue to push towards new heights in this highly competitive field. Our comprehensive portfolio covers a wide spectrum of semiconductor applications servicing the telecommunications, consumer, automotive and other industries through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. Our global footprint spans over 2 top-notched R&D facilities and 6 manufacturing locations in the Asia Pacific region, with global sales outreach as our sales network provide close technology collaboration and efficient supply-chain manufacturing to our global customers.
Join us and expand your world.
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