- Yishun North Region (Singapore) Singapore
STATS ChipPAC Pte. Ltd. Hiring! Full Time Lithography Senior- Process Engineer in North Region (Singapore), Earn up to SGD 6,000 - Ricebowl
Lithography Senior- Process Engineer
STATS ChipPAC Pte. Ltd.
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Job Description
Responsibilities
About the role
Support Lithography Process modules and manage process related activities for eWLB line to meet customer's expectations and requirements. This position reports to the Manager of eWLB Process Engineering.
Key responsibilities
Ensure process capability and continuous improvement plans to meet customer expectations
Perform Process Characterization using Statistical methods
Provide timely material disposition to meet customer delivery
Work with cross functional team for new product/ process development, yield enhancement, cost reduction, capacity expansion and productivity improvement
Interact with customer on special request, audit, visit and quality incident
Perform equipment selection and qualification
Perform continuous improvement in terms of process stability, product quality, cycle time and cost improvement
Review process capability periodically and explore opportunity for cost/ productivity/ cycle time improvement
Develop and update process technology roadmap
Provide progress report at the end of every workweek, month and quarter
About you
Degree in Electrical/ Electronics/ Mechanical/ Chemical Engineering/ Material Science or its equivalent
Preferably 2 years working experience in Lithography process in Wafer Fab or Bump Fab
Join a leader in the industry!
STATS ChipPAC, a member of the JCET Group, is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services encompassing semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to customers around the world. Ranked as the third largest Outsourced Semiconductor Assembly and Test (OSAT) company, opportunities abound in growth and development as we continue to push towards new heights in this highly competitive field. Our comprehensive portfolio covers a wide spectrum of semiconductor applications servicing the telecommunications, consumer, automotive and other industries through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. Our global footprint spans over 2 top-notched R&D facilities and 6 manufacturing locations in the Asia Pacific region, with global sales outreach as our sales network provide close technology collaboration and efficient supply-chain manufacturing to our global customers.
Join us and expand your world.
Support Lithography Process modules and manage process related activities for eWLB line to meet customer's expectations and requirements. This position reports to the Manager of eWLB Process Engineering.
Key responsibilities
Ensure process capability and continuous improvement plans to meet customer expectations
Perform Process Characterization using Statistical methods
Provide timely material disposition to meet customer delivery
Work with cross functional team for new product/ process development, yield enhancement, cost reduction, capacity expansion and productivity improvement
Interact with customer on special request, audit, visit and quality incident
Perform equipment selection and qualification
Perform continuous improvement in terms of process stability, product quality, cycle time and cost improvement
Review process capability periodically and explore opportunity for cost/ productivity/ cycle time improvement
Develop and update process technology roadmap
Provide progress report at the end of every workweek, month and quarter
About you
Degree in Electrical/ Electronics/ Mechanical/ Chemical Engineering/ Material Science or its equivalent
Preferably 2 years working experience in Lithography process in Wafer Fab or Bump Fab
Join a leader in the industry!
STATS ChipPAC, a member of the JCET Group, is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services encompassing semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to customers around the world. Ranked as the third largest Outsourced Semiconductor Assembly and Test (OSAT) company, opportunities abound in growth and development as we continue to push towards new heights in this highly competitive field. Our comprehensive portfolio covers a wide spectrum of semiconductor applications servicing the telecommunications, consumer, automotive and other industries through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. Our global footprint spans over 2 top-notched R&D facilities and 6 manufacturing locations in the Asia Pacific region, with global sales outreach as our sales network provide close technology collaboration and efficient supply-chain manufacturing to our global customers.
Join us and expand your world.
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