LYTE Hiring! Full Time Operations Engineer – III-V Photonics Manufacturing in 台灣 - Ricebowl

About Lyte

Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit *************

If you’re excited about building impactful technology in a dynamic, hands-on environment, we’d love to hear from you!

About the role

• We are seeking an experienced Operations Engineer based in Taiwan to lead Lyte’s III-V photonic components - lasers, photodetectors, and related devices - through the full manufacturing lifecycle, from new product introduction (NPI) and process qualification through pilot builds to high-volume production. The scope spans wafer process and integration, bar-level facet coating, bar-to-die test and AOI, chip-on-carrier (CoC) assembly, and burn-in/CoC test. You will manage and work closely with Lyte’s foundry, OSAT, and contract manufacturing partners in Taiwan and Asia to qualify processes, scale yield and capacity, and drive disciplined ramps from first engineering builds to sustained volume manufacturing for the III-V components at the heart of Lyte’s 4D FMCW lidar sensors.

What you'll do

• Serve as Lyte’s on-the-ground operations engineer at III-V compound semiconductor foundry and OSAT partners in Taiwan and Asia, overseeing day-to-day production of wafer process, laser bars, and photonic dies.
• Partner with wafer suppliers’ engineering teams on incoming wafer quality control and III-V epitaxial growth process control and yield against Lyte’s specifications.
• Work closely with foundry partners on III-V wafer-level process improvement — raising Cp/Cpk and reducing defects — to support both NPI qualification and sustained volume yield.
• Own quality for post-wafer processing steps including bar-level facet coating, bar-to-die singulation, die testing, and automated optical inspection (AOI), driving yield and quality improvements from first article through volume production.
• Manage chip-on-carrier (CoC) assembly processes at contract manufacturing/assembly partners, including process qualification, line set-up, and production ramp support.
• Own burn-in and CoC test operations, including real-time test data review, screening criteria, and failure analysis to ensure reliability targets are met at both low-volume NPI builds and full production rates.
• Drive root cause analysis and corrective action for yield excursions and quality escapes across epi, wafer fab, facet coating, die test, CoC assembly, burn-in, and CoC test.
• Own new product introduction (NPI) and process qualification for new epi structures, wafer processes, and packaging configurations, then drive the disciplined transfer into stable, high-volume manufacturing in partnership with Lyte’s engineering team and manufacturing partners.
• Partner with design and process engineering during NPI to drive design-for-manufacturing (DFM) and design-for-test (DFT) improvements that reduce cost and improve yield ahead of volume ramp.
• Develop capacity plans and line-balancing strategies with foundry, OSAT, and contract manufacturing partners to scale output as programs move from prototype and pilot volumes into full production.
• Establish and maintain SPC, control plans, work instructions, and travelers for each process step, ensuring consistent execution across shifts, partners, and production stages.
• Track and report production yield, cycle time, WIP, and quality metrics against ramp milestones; escalate risks to build plans and provide regular status updates to Lyte’s US-based engineering and operations leadership.
• Coordinate component and material supply with foundry, OSAT, and contract manufacturing partners to support build plans and production schedules through the ramp to volume.
• Travel to and work on-site at partner fabs, assembly houses, and test facilities across Taiwan and Asia as needed to resolve issues and support production ramps.
• Collaborate cross-functionally with Lyte’s optical, chip design, packaging, and systems engineering teams (many based in the US) across time zones to translate design intent into manufacturable, high-yield processes.

Required Qualifications

• Bachelor’s degree in Materials Science, Electrical Engineering, Physics, Optical/Photonics Engineering, Chemical Engineering, or a related technical field (or equivalent hands-on industry experience).
• 3-5 years of Hands-on experience with III-V compound semiconductor wafer processing (GaAs and/or InP).
• Demonstrated experience taking hardware or semiconductor products through the full manufacturing lifecycle - from NPI and process/design qualification, through pilot builds, to high-volume production ramp.
• Direct experience with post-wafer, bar-level processes: facet coating, bar-to-die testing, and automated optical inspection (AOI).
• Hands-on experience with chip-on-carrier (CoC) assembly, burn-in, and CoC test processes.
• Solid understanding of DFB laser structures and epitaxial design fundamentals for optoelectronic devices.
• Experience working directly with foundries, OSATs, or contract manufacturers on process control, yield improvement, and quality — across both low-volume qualification builds and high-volume production.
• Strong data analysis skills, including SPC, DOE, and Cp/Cpk-based yield and quality reporting.
• Excellent verbal and written communication skills; comfortable working on-site with manufacturing partners and coordinating with cross-functional, cross-time-zone engineering teams.
• Willingness to travel regularly to, and/or be based near, partner fab, assembly, and test sites in Taiwan.
• Fluency in Mandarin and English, sufficient to work with local manufacturing partners and Lyte’s global engineering teams.

Preferred Qualifications

• Advanced degree in Materials Science, Electrical Engineering, Physics, or a related field.
• Direct experience with DFB or FP laser diode and photodiode epitaxial structures and device physics
• Prior experience in a contract manufacturing (EMS) or OSAT environment, leading products from NPI through mass-production ramp, including multiple ramp cycles across different product generations
• Experience qualifying a second manufacturing source or transferring a process from an NPI/pilot line to a high-volume production line
• Experience with production ramp planning methodologies — ramp curves, capacity modeling, line balancing, and process validation (e.g., PPAP-style qualification)
• Familiarity with MOCVD or MBE epitaxial growth equipment and process characterization tools (SIMS, XRD, AFM, SEM, photoluminescence, Hall measurement)
• Experience with optical/laser component test and characterization (L-I-V, spectral, reliability/life testing)
• Six Sigma, Lean Manufacturing, or equivalent continuous-improvement experience
• Experience supporting a fabless or vertically integrated photonics/lidar company while coordinating with a US-based engineering headquarters.
• Familiarity with lidar, FMCW, or automotive/robotics sensor technologies.

Benefits (subject to location and local regulations)

• Competitive salary and equity
• Collaborative, fast-paced, and inclusive work environment
• Opportunity to work on cutting-edge technologies with a highly cross-functional team