Elite Photonics Technologies Co. Ltd. Hiring! Full Time Advanced Photonics Packaging Engineer in - Ricebowl

We are looking for an Advanced Photonics Packaging Engineer to support the development of next-generation Near-Packaged Optics (NPO) and high-speed silicon photonics products for AI and data-center applications.

The role will focus on the integration of silicon photonic PICs, electronic ICs, optical interfaces, and advanced packaging technologies, from concept development through prototype and product qualification.

Key Responsibilities

- Develop advanced packaging solutions for NPO and silicon photonics products.

- Design and optimize integration of PICs, EICs/Drivers/TIAs, optical interfaces, substrates and interposers.

- Develop optical coupling solutions including fiber arrays, edge coupling and other high-density optical interfaces.

- Work on advanced assembly technologies such as flip-chip, micro-bump, wire bonding, underfill and high-density interconnects.

- Address key photonic packaging challenges including optical alignment, thermal management, RF/signal integrity, mechanical tolerance and reliability.

- Work closely with PIC design, electronics, test and manufacturing teams to develop packaging requirements and solutions.

- Coordinate with OSATs, packaging houses and suppliers for prototype development, process qualification and production ramp.

- Support package characterization, reliability testing, failure analysis and yield improvement.

Requirements

- Bachelor's degree or above in Photonics, Optoelectronics, Electrical/Electronic Engineering, Microelectronics, Materials Science or related fields.

- Experience in silicon photonics, optical transceiver or optoelectronic packaging.

- Good understanding of PIC packaging and fiber-to-chip optical coupling.

- Familiarity with advanced semiconductor packaging technologies and assembly processes.

- Experience with NPO, CPO, optical engines, 800G/1.6T transceivers or high-speed optical interconnects is highly preferred.

- Knowledge of thermal, mechanical, RF or signal-integrity considerations in high-speed photonic packages is an advantage.

Candidates with hands-on experience developing photonic packaging from prototype to product qualification are highly preferred.