FusionAP Hiring! Full Time Principal Technology Development Engineer – Thermal-Compression Bonding (TCB) in Pulau Pinang - Ricebowl

Principal Technology Development Engineer – Thermal-Compression Bonding (TCB)

Senior Level | 10+ Years Experience | FCBGA Assembly, Die-to-Wafer 2.5D Packaging

Role Summary: The rapid expansion of artificial intelligence, high performance computing (HPC), and cloud-focused networking has positioned advanced packaging as a critical differentiator in semiconductor manufacturing. We are seeking a highly motivated and experienced Principal Technology Development Engineer specializing in Thermal-Compression Bonding (TCB) to drive next-generation packaging solutions

In this role, you will operate at the intersection of wafer fab processing, material science, and mechanical assembly 3. You will focus on TCB recipe creation, process optimization, and deep cross-process integration to support high-yield, cost-effective semiconductor manufacturing for advanced architectures

Key Responsibilities

Process Development & Innovation: Develop, optimize, and maintain TCB recipes for advanced packaging applications, including die stacking, chip-to-wafer, and chip-to-substrate integrations for solders to Cu, solders to solders or Cu-Cu hybrid bonding

Precision Bonding Parameters: Optimize critical TCB thermal profiles, such as rapid heating and cooling rates, dynamic force triggers, includes carefully controlling solder wetting to prevent bridging and avoiding "white bump" micro-cracking in fragile extreme low-k (ELK) dielectric layers.

Experimental Rigor: Design and execute multi-factor Design of Experiments (DOE) to establish robust process windows and performance baselines.

Process Integration & Interaction: Analyse the impact of material changes, equipment variations, and upstream wafer and Flip Chip processes on overall TCB performance. You will utilize polymer re-passivation layers as internal stress buffers to alleviate local strain on fragile die structures during rapid thermal cycles.

Yield Improvement & Quality Control: Lead continuous yield improvement, defect reduction, and cost optimization initiatives 8. You will implement Statistical Process Control (SPC) and apply methodologies like FMEA, Control Plans, 8D, and root cause analysis to resolve process excursions and also establish effective early signal detection from various learning

Equipment & Material Engineering: Evaluate, qualify, and optimize TCB equipment, tooling, and materials while working closely with suppliers to manage specifications, quality, and risk.

Technology Transfer: Own the process transfer from the research and development phase to high-volume manufacturing (HVM), establishing the official Process of Record (POR) and supporting new tool installations and production ramps.

Minimum Qualifications

Bachelor’s degree in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Physics, or a related technical field.

10+ years of experience in semiconductor process engineering, with a strong preference for backgrounds in Flip Chip or Advanced Packaging.

Deep expertise in TCB or related die-bonding technologies, with a solid understanding of assembly processes and upstream/downstream interactions.

Hands-on experience with DOE, SPC, FMEA, and advanced data analysis techniques.

Strong analytical, problem-solving, and data interpretation skills, with the ability to work independently and lead projects.

Excellent communication and teamwork abilities to collaborate effectively across multidisciplinary teams.

Preferred Qualifications

Master’s degree or Ph.D. in a related engineering or scientific discipline.

Experience in advanced packaging technologies, including 2.5D/3D integration, multi-die chiplets, and wafer bonding.

Deep knowledge of material science related to bonding interfaces, including solders, Cu-Cu bonding, underfill, and intermetallic compound formation.

Familiarity with equipment automation, data analytics, and programming languages such as Python or SQL for tracking critical-to-quality metrics

Proven experience in project management and cross-site technology transfer

Additional Information

• Location: Batu Kawan | Work Model: on Site

• Travel: minimum, except for training at suppliers or technical conferences

• Language: Fluent English (written and verbal); additional language proficiency a plus for global collaboration