- Yishun North Region (Singapore) Singapore
STATS ChipPAC Pte. Ltd. Hiring! Full Time Senior-Yield Engineer in North Region (Singapore), Earn up to SGD 5,500 - Ricebowl
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About us
STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.
About the role
Solves difficult problems through assessment of various techniques and approaches to develop appropriate, creative and practical solutions. Solutions typically result in improved products, processes or quality. Provide leadership to make a difference.
Key responsibilities
Conduct detailed yield analysis to improve product quality and drive manufacturing efficiency and profitability
Collaborate with cross-functional teams (Process, Equipment, QA, etc.) to drive yield improvement initiatives and support continuous improvement projects
Lead yield-related audits and reviews, including preparation of documentation and presentation of findings to internal stakeholders and external customers
Liaise with customers on development and improvement of process, material and equipment capabilities
Generate and maintain weekly yield reports to monitor production performance, highlight trends and identify anomalies or deviations
Conduct yield analysis to identify yield loss mechanisms, quality issues, and opportunities for process improvement
Drive yield improvement initiatives through root cause analysis and implementation of corrective and preventive actions (CAPA)
Monitor and report yield performance through regular dashboards and trend analysis, highlighting risks and improvement opportunities
Lead yield-related investigations, audits, and customer reviews, including preparation of technical reports and presentations
Support customer engagements, process qualifications, and continuous improvement projects to enhance process, material, and equipment capabilities
What we're looking for
Bachelor's degree in Mechanical Engineering, Electrical Engineering, or a related field
2-5 years of relevant experience in semiconductor process engineering / yield engineering preferred
Knowledge of Wafer Level Chip Scale Packaging (WLCSP) operations is advantageous
Proficient in data analysis and reporting tools such as Microsoft Excel, JMP, Tableau or Python or Fine Bi
Project management skills to ensure timely and successful project delivery
Independent self-starter to drive to meet operation goals
High level of commitment and passion
Join a leader in the industry!
STATS ChipPAC, a member of the JCET Group, is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services encompassing semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to customers around the world. Ranked as the third largest Outsourced Semiconductor Assembly and Test (OSAT) company, opportunities abound in growth and development as we continue to push towards new heights in this highly competitive field. Our comprehensive portfolio covers a wide spectrum of semiconductor applications servicing the telecommunications, consumer, automotive and other industries through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. Our global footprint spans over 2 top-notched R&D facilities and 6 manufacturing locations in the Asia Pacific region, with global sales outreach as our sales network provide close technology collaboration and efficient supply-chain manufacturing to our global customers.
Join us and expand your world.
STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.
About the role
Solves difficult problems through assessment of various techniques and approaches to develop appropriate, creative and practical solutions. Solutions typically result in improved products, processes or quality. Provide leadership to make a difference.
Key responsibilities
Conduct detailed yield analysis to improve product quality and drive manufacturing efficiency and profitability
Collaborate with cross-functional teams (Process, Equipment, QA, etc.) to drive yield improvement initiatives and support continuous improvement projects
Lead yield-related audits and reviews, including preparation of documentation and presentation of findings to internal stakeholders and external customers
Liaise with customers on development and improvement of process, material and equipment capabilities
Generate and maintain weekly yield reports to monitor production performance, highlight trends and identify anomalies or deviations
Conduct yield analysis to identify yield loss mechanisms, quality issues, and opportunities for process improvement
Drive yield improvement initiatives through root cause analysis and implementation of corrective and preventive actions (CAPA)
Monitor and report yield performance through regular dashboards and trend analysis, highlighting risks and improvement opportunities
Lead yield-related investigations, audits, and customer reviews, including preparation of technical reports and presentations
Support customer engagements, process qualifications, and continuous improvement projects to enhance process, material, and equipment capabilities
What we're looking for
Bachelor's degree in Mechanical Engineering, Electrical Engineering, or a related field
2-5 years of relevant experience in semiconductor process engineering / yield engineering preferred
Knowledge of Wafer Level Chip Scale Packaging (WLCSP) operations is advantageous
Proficient in data analysis and reporting tools such as Microsoft Excel, JMP, Tableau or Python or Fine Bi
Project management skills to ensure timely and successful project delivery
Independent self-starter to drive to meet operation goals
High level of commitment and passion
Join a leader in the industry!
STATS ChipPAC, a member of the JCET Group, is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services encompassing semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to customers around the world. Ranked as the third largest Outsourced Semiconductor Assembly and Test (OSAT) company, opportunities abound in growth and development as we continue to push towards new heights in this highly competitive field. Our comprehensive portfolio covers a wide spectrum of semiconductor applications servicing the telecommunications, consumer, automotive and other industries through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. Our global footprint spans over 2 top-notched R&D facilities and 6 manufacturing locations in the Asia Pacific region, with global sales outreach as our sales network provide close technology collaboration and efficient supply-chain manufacturing to our global customers.
Join us and expand your world.
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