Job Summary
This hands-on role supports and improves semiconductor plasma processing equipment and develops new products, focusing on concept and feasibility activities including process proposal, validation, recipe formulation, and performance testing.
Responsibilities
Develop and optimize plasma etch and CVD processes to meet targets for critical film properties, etch rate, uniformity, selectivity, and profile performance
Generate detailed process specifications and define operational windows for next-generation semiconductor reactors
Collaborate with hardware and subsystem suppliers to evaluate and optimize process-critical components such as showerheads, gas delivery, and pressure control
Develop new plasma process regimes and chemistry strategies to enhance reactor capabilities for advanced technology nodes
Design and execute process experiments (DOE) to identify and mitigate defectivity, wafer damage, and plasma instability
Select materials and precursors to evaluate new gas chemistry combinations and ensure material compatibility for advanced film applications
Apply process metrology and diagnostic techniques (e.g., OES, mass spectrometry) to characterize plasma properties and integrate end-point control
Collaborate closely with cross-functional teams and implement process improvement initiatives
Required competencies and certifications
Hold a Masters or PhD in Chemical Engineering, Material Science, or a closely related field with at least 5 years of relevant industry or academic experience
Demonstrate strong oral and written communication skills to clearly present complex technical ideas
Apply structured problem-solving methodologies such as Root Cause Analysis, Six Sigma, Fishbone Diagram, and 5 Whys
Preferred competencies and qualifications
Familiarity with semiconductor process and characterization tools such as SEM, film thickness and stress measurement, plasma diagnostic tools, and OES
Knowledge of material properties, thin film characterization, and plasma chemistry dynamics
Hands-on experience with wafer handling, chamber maintenance, manual tool operation, and basic mechanical/gas-line assembly