全职 Process Engineer (Die Attach & Glass Attach) Jobs, salary up to MYR 2 in ASE Electronics (M) Sdn. Bhd. Bayan Lepas - Ricebowl

1. Degree in Mechanical/ Electronics / Electrical /Mechanical Engineering.

2. Min 2 years in semiconductor industry in the field of assembly engineering.

3. Experience in die/glass attach process.

4. Good knowledge of FMEA, DOE, SPEC and risk analysis.

5. Independent with good communication skills and ability to work effectively in a cross functional environment with people at all levels.

Job Overview:

Support production line in achieving Quality, Delivery, Cycle Time, and Process Improvement, Cost Saving and Improve Equipment Stability such MTBF and MTBA.

Support NPI build on new recipe creation for new device, data collection and Qual for new device

1. Responsible for process ownership of DA/GA machine in assembly line.

2. Establish and setup new DA/GA assembly process capabilities and materials including hand-on equipment setup.

3. Monitor performance, quality and reliability of die attach process. Identify problems, recommendation, and implementation of corrective and preventive actions.

4. Support engineering build requests, ramp ups and platform extensions.

5. Monitor and improving the yield of DA/GA process, including cost reduction activities.

6. Support on the TMM and TMS activities

• Annual Leave
• Medical and Hospitalisation Leave
• EPF
• SOCSO
• Annual Bonus
• Medical Insurance