jobs in ASE Electronics (M) Sdn Bhd.

ASE Electronics (M) . Hiring! Full Time Packaging Engineer in Pulau Pinang, Earn up to MYR 7,000 - Ricebowl

Working Location

  • Bayan Lepas Pulau Pinang Malaysia

Job Description

Responsibilities

Job Overview:

Responsible for NPI and mass production release, yield management and failure analysis, cross-functional collaboration, customer technical support, and cost reduction through process optimization.

Primary Responsibilities:

1. Process characterization for new device

2. Projects of process improve/UPH/cost down

3. Train OP/ME for new device or new process

4. Exclude MFG excursion

5. Yield Improvement: Improved report / On Time%

6. Project / Task: Effectiveness Achievement% / Project Report / On-Time%

7. Qual lot / Engineering lot handle: Risk Assessment Report / Process CZ / Pass%

8. Abnormal Case handle / Customer complaint handle: Investigation Report / 8D Report

9. BKM: Technology Report & Patent: Patent Application Report

10. Customer Audit: Audit Readiness Review Achievement %

11. Ensure on-time delivery of NPI and engineering projects by meeting established schedules, milestones, and project targets.

12. Achieve mass production yield targets, improve First-Time-Right (FTR) rates, and maintain accurate and complete engineering documentation.

13. Crisis management & responsiveness to ensure timely abnormal lot disposition, effective root cause analysis, and corrective actions to minimize the recurrence of systemic issues.

14. Cost management & continuous improvement to drive cost reduction, process optimization, and continuous improvement projects.

Qualification & Experience:

1. Bachelor's degree in Electrical Engineering, Electronics Engineering, Mechanical Engineering, or a related field.

2. 5+ years of experience in semiconductor assembly equipment, automation system engineering.

3. Strong understanding of semiconductor assembly equipment and processes, including Wafer Mount, Wafer Saw, WLCSP Incoming, Die Attach, Wire Bond, 2nd Wire Bond, Molding, Plasma, Dejunk/Trim, Deflash, Solder Plating, Plating Baking, Laser Topside Mark, Forming / Singulation, Burn In Test, Package Function Test, Final Visual Inspection, and Packing.

4. Experience in project management and cross-functional team collaboration.

Pay: RM3,200.00 - RM7,000.00 per month

Benefits:

  • Free parking
  • Meal allowance

Application Question(s):

  • How long is your notice period?
  • How much is your expected salary?

Education:

  • Diploma/Advanced Diploma (Preferred)

Work Location: In person

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