- Yishun North Region (Singapore) Singapore
STATS ChipPAC Pte. Ltd. Hiring! Full Time Senior - Process Associate Engineer in North Region (Singapore), Earn up to SGD 3,500 - Ricebowl
Senior - Process Associate Engineer
STATS ChipPAC Pte. Ltd.
Share
Save
Working Location
Job Description
Responsibilities
About us
STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.
About the role
To provide technical and administrative support to Process Engineers in CoW Dept to ensure total customer satisfaction related to product quality, productivity and cost effectiveness.
Key responsibilities
Troubleshooting line issues in Flip Chip Attach, Reflow, Wafer Clean, Plasma, Underfill and Oven Cure area
Support small improvement projects assigned by Process Engineer
Act as communication channels to transmit all messages/information (in particular process change related) to production floor
Immediate response to analyze products with problem
Cross support with line supervisor to clear real time bottleneck that impact cycle time and quality
Cross support with others Process Associate Engineer to clear equipment down times
What we're looking for
Diploma in any Engineering field
Ability to work 12 hours rotating shift
Positive mindset and ability to adapt to fast-paced working environment
Willingness to study the process of Flip Chip Attach, Reflow, Wafer Clean, Plasma, Underfill and Oven Cure
Fresh graduate is encouraged to apply
Join a leader in the industry!
STATS ChipPAC, a member of the JCET Group, is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services encompassing semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to customers around the world. Ranked as the third largest Outsourced Semiconductor Assembly and Test (OSAT) company, opportunities abound in growth and development as we continue to push towards new heights in this highly competitive field. Our comprehensive portfolio covers a wide spectrum of semiconductor applications servicing the telecommunications, consumer, automotive and other industries through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. Our global footprint spans over 2 top-notched R&D facilities and 6 manufacturing locations in the Asia Pacific region, with global sales outreach as our sales network provide close technology collaboration and efficient supply-chain manufacturing to our global customers.
Join us and expand your world.
STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.
About the role
To provide technical and administrative support to Process Engineers in CoW Dept to ensure total customer satisfaction related to product quality, productivity and cost effectiveness.
Key responsibilities
Troubleshooting line issues in Flip Chip Attach, Reflow, Wafer Clean, Plasma, Underfill and Oven Cure area
Support small improvement projects assigned by Process Engineer
Act as communication channels to transmit all messages/information (in particular process change related) to production floor
Immediate response to analyze products with problem
Cross support with line supervisor to clear real time bottleneck that impact cycle time and quality
Cross support with others Process Associate Engineer to clear equipment down times
What we're looking for
Diploma in any Engineering field
Ability to work 12 hours rotating shift
Positive mindset and ability to adapt to fast-paced working environment
Willingness to study the process of Flip Chip Attach, Reflow, Wafer Clean, Plasma, Underfill and Oven Cure
Fresh graduate is encouraged to apply
Join a leader in the industry!
STATS ChipPAC, a member of the JCET Group, is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services encompassing semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to customers around the world. Ranked as the third largest Outsourced Semiconductor Assembly and Test (OSAT) company, opportunities abound in growth and development as we continue to push towards new heights in this highly competitive field. Our comprehensive portfolio covers a wide spectrum of semiconductor applications servicing the telecommunications, consumer, automotive and other industries through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. Our global footprint spans over 2 top-notched R&D facilities and 6 manufacturing locations in the Asia Pacific region, with global sales outreach as our sales network provide close technology collaboration and efficient supply-chain manufacturing to our global customers.
Join us and expand your world.
Important Information
Never provide your bank or credit card details when applying for jobs. Do not transfer any money or complete unrelated online surveys. If you see something suspicious, Report this Job ad.
Learn More