jobs in MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. Hiring! Full Time Senior NPI Engineer in North Region (Singapore), Earn up to SGD 6,000 - Ricebowl

Senior NPI Engineer

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

North Region (Singapore)

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Working Location

  • 1 NORTH COAST DRIVE North Region (Singapore) Singapore

Job Description

Responsibilities

NPI Program Management – APTD NPI Operations

KEY RESPONSIBILITIES: APTD NPI Program Management

Program & Project Leadership

  • Lead all aspects of the full lifecycle of APTD programs, including planning, execution, monitoring, and closure.

  • Define program objectives, deliverables, resource plans, and success metrics.

  • Lead cross-functional teams across APTD, PDE, CPI, and NPI to ensure timely, high-quality delivery of critical initiatives.

Governance & Operational Excellence

  • Develop and implement standardized PMO methodologies, tools, and templates.

  • Lead CapEx and OpEx planning, PTM and MOR processes, and integrate BOP design systems.

  • Ensure compliance with internal governance standards and external customer requirements.

Strategic Alignment & Communication

  • Align program goals with APTD’s charter to embed analytics and simulation into development workflows.

  • Drive team member engagement across BU, PDT, TPM, and central engineering teams.

  • Provide leadership with regular updates on program status, risks, and mitigation strategies.

Performance & Accountability

  • Define and track critical metrics for program success, yield reporting, and EOL accountability.

  • Conduct program reviews to assess outcomes and bring together lessons learned.

  • Mentor project managers and foster continuous improvement across PMO practices.

Qualifications

  • Bachelor’s or Master’s degree in Engineering, Materials Science, or related technical field.

  • 3+ years of experience in semiconductor packaging, process integration, or technology development.

  • Proven record leading complex, cross-functional programs in a high-tech environment.

  • Solid understanding of advanced packaging flows (e.g., hybrid bonding, CoWoS, chiplet integration).

  • Outstanding communication, leadership, and stakeholder management skills.

  • Familiarity with frameworks such as PDE, CPI, and NPI.

AI Responsibilities

  • Utilize AI-assisted tools responsibly to improve productivity, efficiency, and quality of work while adhering to company policies and applicable regulations.

  • Explore, learn, and share AI-enabled process improvements that can enhance operational effectiveness within the team.

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