- Bayan Lepas Bayan Lepas Pulau Pinang Malaysia 11900

Working Location
Job Description
Requirements
Education Requirement:
Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
Job Overview:
Wire bond Engineer is responsible for designing, developing and optimizing process for manufacturing to achieve delivery goals and quality.
Responsibilities
Develop, formulate, evaluate and execute process engineering in area of responsibility to improve yield, quality and productivity and cost.
Monitor, identifies, verifies analysis and give disposition to process related and technical concern of the product.
Conduct evaluation to characterize failure in terms of extent of damage and gives disposition on implications attribute to process handling materials defects or machine trouble.
Follow up all on going evaluation in the assigned area and handle on the line technical trouble.
Interfaces with personnel on production, QA and other support groups regarding product/process related problems and disposition.
Prepares the necessary process instruction and conduct training to the floor member.
Review process requirements, customers specifications and standard.
Drive cost reduction project or second source program.
Liaise with customer on matters related to yield, quality, etc
Benefits
Important Information
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