jobs in RANDSTAD PTE. LIMITED

RANDSTAD PTE. LIMITED Hiring! Full Time Lead-Silicon Photonics Design Engineer in Central Region (Singapore), Earn up to SGD 8,000 - Ricebowl

Lead-Silicon Photonics Design Engineer

RANDSTAD PTE. LIMITED

Central Region (Singapore)

Share
Save

Working Location

  • 8 CROSS STREET Central Region (Singapore) Singapore

Job Description

Responsibilities

Key Responsibilities

  • Lead,mentor,and grow a small,agile team of engineers dedicated to Silicon Photonics PIC development,fostering a culture of high-ownership and rapid iteration.
  • Drive the design,optimization,and integration of passive and active PIC building blocks,including waveguides,modulators,detectors,couplers,and heaters.
  • Manage the end-to-end tape-out process on foundry PDKs for MPW and production runs.
  • Oversee layout hierarchy,verification flows,DRC/LVS checks,fill/density rules,and GDS/mask readiness.
  • Execute photonic,thermal,and tolerance simulations.
  • Translate results into robust design rules,performance margins,and practical engineering tradeoffs.
  • Define test structures,measurement plans,and acceptance criteria.
  • Analyze electro-optic data from first-silicon to drive model updates,yield improvements,and manufacturability.

Requirements

  • Master's or ************* Electrical Engineering,Physics, Photonics,Optics,or a closely related field
  • 5+ years of hands-on industry experience in integrated silicon photonics PIC design (both active and passive devices).
  • Demonstrated track record of taking designs through tape-out to silicon.
  • Must be highly capable of producing DRC-clean layouts and executing disciplined verification procedures.
  • Hands-on expertise with industry-standard simulation software (Lumerical,RSoft,or COMSOL) and layout platforms (KLayout,Cadence,or IPKISS).
  • Direct experience with high-speed micro-ring or Mach-Zehnder modulators (MRM/MZM),dense Wavelength-Division Multiplexing (WDM) architectures, and Co-Packaged Optics (CPO).
  • Familiarity with heterogeneous integration (e.g.,III-V/Si hybrid lasers) and an understanding of packaging,thermal design, and reliability for transceiver-class PICs.

If you are interested in the position, kindly apply to this job or send your CVs to *************(@)*************

We regret that only shortlisted candidates will be contacted

EA: 94C3609 / R1325913

Important Information

Never provide your bank or credit card details when applying for jobs. Do not transfer any money or complete unrelated online surveys. If you see something suspicious, Report this Job ad.

Learn More