Pride Global Hiring! Full Time Package Design Engineer – Semiconductor in Pulau Pinang - Ricebowl

We’re Hiring: Package Design Engineer – Semiconductor

Location: Penang, Malaysia

Experience: 4+ Years

Are you experienced in semiconductor package design and looking for your next career opportunity? We are looking for skilled engineers with a strong background in package design, layout, and advanced packaging technologies to join our team.

Key Requirements:

• Package Design Experience: Minimum 4 years of experience in semiconductor package design, substrate design, package layout, or advanced packaging development.
• EDA Tools & Technical Skills: Hands-on experience with tools such as Cadence Allegro or Mentor Xpedition, along with knowledge of package layout, design verification, and manufacturability.
• Advanced Packaging Knowledge: Understanding of 2.5D/3D packaging, chiplet integration, interposer, RDL, SI/PI, and thermal or reliability considerations will be an added advantage.

Key Responsibilities:

• Develop and execute semiconductor package design solutions based on project requirements.
• Work closely with silicon design, signal integrity, thermal, mechanical, and manufacturing teams to ensure design quality and performance.
• Support package layout, design verification, and manufacturability requirements throughout the development cycle.
• Collaborate with internal teams, external vendors, and manufacturing partners to resolve design challenges and meet project timelines.

We welcome candidates with strong technical skills, a problem-solving mindset, and the ability to work effectively with cross-functional teams.

Interested? Send me your updated CV via ************* or LinkedIn DM to explore this opportunity or WS me @*************

Feel free to share this post or refer someone who may be a good fit!

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