Qualcomm

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Singapore

  • Monitor and analyse process data to identify trends, risks, and improvement opportunities.
  • Lead troubleshooting and problem-solving activities for process abnormalities, yield loss, quality excursions, and production issues.
  • Drive permanent corrective and preventive actions to resolve chronic process and quality issues. ...
Posted
11 days ago

Singapore

  • Direct working experience in wafer fab facilities will be added advantage.
  • Possess strong technical competencies in his field of study.
  • Able to work under pressure and with strong commitment at work. ...
Posted
11 days ago

Singapore

  • Design and optimize data models across SQL and NoSQL platforms used for device, product, and test data.
  • Collaborate closely with cross‑functional partners including product and test engineering and IT team.
  • Use AI/LLM‑based tools for code acceleration, documentation, data analysis, and engineering‑vibe synthesis (e.g., summarizing complex discussions, generating prototypes, analyzing large datasets). ...
Posted
11 days ago

Singapore

  • Partner closely with process module engineers, manufacturing, quality, and equipment teams to resolve process-related yield excursions.
  • Develop and implement effective corrective, and preventive actions to eliminate recurrence of process and quality issues.
  • Lead cross-functional investigations and continuous improvement projects to improve process capability and manufacturing robustness. ...
Posted
16 days ago

Singapore

  • Implement effective work methodologies to ensure consistently high-quality output and productivity.
  • Together with engineering team, effective execution of assigned WI, SOP and target.
  • Drive together with Engineers in minimizing scraps and mishandling in the line. ...
Posted
16 days ago

Singapore

  • Utilize expertise in process integration between Fabrication (FAB) facilities and Outsourced Semiconductor Assembly and Test (OSAT) companies to anticipate and address potential integration challenges.
  • In-depth knowledge of Backend-of-the-Line (BEOL) processes, with an additional benefit on experience in photolithography techniques.
  • Conversant with substrate and assembly packaging processes for RF-SiP (Radio Frequency-System in Package) applications. ...
Posted
18 days ago

Singapore

Posted
19 days ago