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Singapore

  • Utilize expertise in process integration between Fabrication (FAB) facilities and Outsourced Semiconductor Assembly and Test (OSAT) companies to anticipate and address potential integration challenges.
  • In-depth knowledge of Backend-of-the-Line (BEOL) processes, with an additional benefit on experience in photolithography techniques.
  • Conversant with substrate and assembly packaging processes for RF-SiP (Radio Frequency-System in Package) applications. ...
Posted
13 days ago

台灣

Posted
14 days ago

Singapore

Posted
15 days ago

Singapore

Posted
15 days ago

Singapore

Posted
15 days ago

台灣

Posted
15 days ago

台灣

Posted
15 days ago